Caeleste and BrainVision Cooperate on ToF Technology

...
Brainvision Inc. (Tokyo, Japan) and Caeleste (Antwerp, Belgium) have materialized their licence agreement on the design of ToF image sensors based on Caeleste’s patent US7564022. The design collaboration started in December 2010. An image from the first VGA resolution sensor now succesfully demonstrated:


The key advantage of Caeleste patented technology is said to reside in the strict usage of standard, mainstream CMOS technology, leading to lowest possible manufacturing cost. Brainvision and Stanley Electric (Tokyo, Japan) aim to serve the high volume applications such as automotive market and machine vision with Caeleste technology.

Caeleste patent relies on depletion field modulation to implement a fast change of the pixel sensitivity:

7:25 AM

Hynix Announces MIPI Sensors Lineup

...
Hynix announced a complete lineup of VGA to 5MP sensors having MIPI interface:

10:26 AM

Samsung Patent Application Improves ToF Sensor Speed

...
Recently published Samsung patent application US20110198481 talks about speeding up a ToF imager based on in-phase/out-of-phase light pulses measurement. The sensor includes a detection portion and a transfer portion separating the signal between two floating diffusions:


The detection portion is a pinned photodiode, while the transfer part consists of photogate, transfer gates Tx1 and Tx2 and floating diffusions FD1 and FD2 separately accumulating in-phase and out-of-phase signals. The photodiode is made has few different doping areas to create a potential stairs and speed the charge transfer to the photogate:



7:03 AM

Albert Theuwissen Starts "How to Measure?" Series

...
Albert Theuwissen started a new series of blog posts called "How to measure ...?". The first post in the series deals with image sensor dark current measurements. Different techniques and different ways to present the results are described.
3:49 AM

Omnivision Quarterly Earnings Call

...
SeekingAlpha published Omnivision's quarterly earnings call transcript for the quarter ended on July 31, 2011. Some quotes:

Shaw Hong, CEO:

...we achieved record quarterly revenue of $276 million and we shipped over 170 million image sensors. ...On a rolling 12-month basis, I am pleased to report that OmniVision has topped the $1 billion market in total revenues.

...We believe there are many directions for strategic growth... This can lead to opportunities in the field of optic sensors, outside visible spectrum, image data processing, data interface chip, and the system solutions. ...we are leveraging the knowledge we acquired from the Kodak patent that we purchased several months ago. These patents ...greatly enhanced our ability to innovate beyond imaging sensors.

...we have a portfolio of more products based on OmniBSI-2. They will be continuously we released to the marketplace in the coming quarters.

Ray Cisneros, VP Worldwide Sales:

...units sales of sensors 2-megapixel and above represented approximately 37% of total shipments, the same percentage as the prior fiscal quarter. In this category of our BSI based 5-megapixel sensor product line continued to ship at record levels in to various markets and was dominated by the smartphone segment.

...unit sales of sensors that were VGA and below represented approximately 45% of total shipments.


Hasan Gadjali, VP Worldwide Marketing and Business Development:

...our OmniBSI-2 and newer OmniBSI products are also designing with the important 30 frame-per-second feature for camera sensors today. The 30 frame-per-second feature is now narrowing the performance gap between cell phone cameras and point-and-shoot digital still cameras. This is a major technical breakthrough.

The high dynamic range feature or HDR originally used in our automotive products to take pictures under extreme lighting condition is already finding its ways into smartphones ...Most OmniBSI-2 and newer OmniBSI products include this HDR capability.


Anson Chan, CFO:

Our fiscal 2012 first quarter gross margin was 31.7%, 1 percentage point higher than the 30.7% that we reported in our prior quarter.

...our BSI-2 devices ...Consistent with our past experience with advance devices, we anticipate less than optimal yields during this initial rollout and this may translate into a temporary reduction in margin.


...our outlook for the second quarter of fiscal 2012, which ends on October 31, 2011. We currently expect our 2012 second fiscal quarter revenues will be in the range of $255 million to $275 million [compared to 276M this quarter - ISW] This range primarily reflects the expansion of the development cycle with our 8-megapixel product line [Apple iPhone 5 miss? - ISW] as well as cautionary part due to macroeconomic uncertainties with various companies sale already discussed in their earnings calls.

After the disappointing outlook many question were obviously centered on it:

Daniel Amir Lazard Capital Markets:

...can you give a little more clarity on the guidance here I mean typically your quarter is up, you guided now. ...could give any clarification that would be helpful.

Ray Cisneros:

In term of the macroeconomics I think what everything that’s going on in the markets; we saw some unsettling in our numbers in front of us. So, in particular in some of the bigger segments such as the notebook and PC segments, those recent events definitely have some perturbations in the marketplace. So, we’re taking a cautionary approach when we look at that those kind of situations. And everything what’s happening in the economy globally is certainly we feel probably influencing some of the numbers.

Raji Gill, Needham & Company:

...this extension of the development of the product cycle on the 8-megapixel, which has to do with smartphones. Could you maybe elaborate what’s going on there? Has that resulted in share loss at some of your key accounts, any details there would be helpful?

Ray Cisneros:

Sure. ...I think the way to look at is when we launch a product, this 8-megapixel is not any different than all our other products that we attempt to launch. It’s quite intensive and extensive R&D and development. So that means, we plan on, I would say, a development lifecycle. And once we execute on that we go into mass production. So, what we see in our 8-megapixel plan is we have a plan and our plan is to hopefully hit at the tail end of this quarter as we mentioned when we can start delivering the 8-megapixel.

Seeking Alpha reports that as of August 25, 5:11PM ET, Omnivision shares plunge -30% in after hours trading following the weak guidance.
11:46 PM

Sony Announces Fast CCD, HD Video Sensor and 1.12um BSI Sensors Family

...
Sony CX-News vol. 65 announces few new imagers: 1-inch 6MP CCD providing full HD video,1/2.8-inch 1080p/30 video CMOS sensor and smartphone-oriented 1.12um BSI sensors.

Industrial applications targeted ICX694 15.99mm-diagonal CCD has 6.09MP resolution and is based on 4.54um pixel. The ICX694's four outputs allow it to operate at 25fps speed at full resolution of 46fps in 1092-line cropping mode. So far diagonal 11 mm (Type 2/3) were the upper optical limit of Sony lineup of image sensors for industrial cameras. Sony used the same "EXviewHAD CCD II" pixels in 1-inch format to increase sensor's resolution while maintaining high IR sensitivity. The CCD is available in B&W and color versions.


The industrial-oriented 1/2.8-inch 2.43MP IMX122LQJ CMOS sensor uses 2.8um pixel arranged in a diagonal fashion. The sensor is said to have improved low light sensitivity by 6db and SNR by 8db as compared to the older Sony 1/3-inch sensors. The claim is supported by pictures (looks like zoom-able to full resolution in the pdf doc):


The 1.12um BSI family consists of 16.41MP/15fps IMX081PQ, 13.25MP/15fps IMX091PQ, and 8.17MP/22.5fps IMX111PQ imagers. Sony says it managed to increase the sensitivity of the new sensor, as measured per unit pixel by about 1.35 times compared to the current 1.4 µm front-illuminated sensors. The saturation signal level is increased by 1.15 times, as converted to value per unit area.


All sensors in the family deliver 1080p/60fps video by addition/averaging processing of up to four pixels of the same color in vertical and horizontal direction. The interface is MIPI (SCI-2) 1,2 or 4 lanes (up to 2 lanes in 8MP sensor).

The sensors integrate some image processing circuitry. Sony says: "substituting high-speed CPUs to process images for dedicated image processors is a strong ongoing trend. The IMX081PQ, IMX091PQ and IMX111PQ have a function for correcting image quality to optimum image data built into the sensor. This function easily provides high picture quality even without processing by an dedicated image processor (See figure 2):"


6:27 AM

Zoran Announces COACH-14 Camera Processor

...
Market Wire: Zoran announced that its COACH 14 camera processor is available to qualified manufacturers of 3D, Full HD video, hybrid and interchangeable-lens cameras.

The 1080p video sometimes suffers from video artifacts introduced by the in-sensor binning of the high-megapixel sensor data. Zoran's COACH 14 SoC is said to eliminate this problem by processing the raw sensor data to create a crisp, full resolution, full-color video stream.

Feature list:
  • Supports Full HD, H.264, multi-stream compression.

  • CMOS Rolling-Shutter Correction Technology

  • Digital Video Stabilization based on digital motion analysis technology that eliminates the need for a gyro, saving manufacturing costs.

  • New set of lens correction technologies

  • Motion Compensated Temporal Filter which reduces noise and improves low-light performance while eliminating blur due to object motion.

  • Dual-sensor support for 3D still and video encoding as well as a direct connection to 3DTVs via an HDMI 1.4 port.

Zoran's COACH processors power digital still and video camera models from Casio, Fujifilm, GE, Kodak, Nikon, Olympus, Pentax, Samsung, Sony, and Vivitar among others. The COACH 14 is currently available to qualified digital camera manufacturers and is being designed into multiple camera models that are planned for production in Q1 2012.

"Adoption of CMOS sensors is accelerating in the digital camera market because they support faster capture speeds and higher quality 1080p video. In 2013, CMOS sensors are forecast to overtake CCD sensors with 70 million CMOS sensors shipping to market versus 65 million CCD sensors," according to Tetsuo Omori, analyst at Techno Systems Research.
7:53 AM

One More 1.75um OminBSI-2 Sensor Announced

...
PR Newswire: Omnivision introduced another 1.75um OmniBSI-2 pixel-based sensor - the 5MP OV5680 SoC. The 1/3.2-inch OV5680 offers 1080p/30fps full-area HD video (or 1080p/60 cropped one). The on-chip scaler enables electronic image stabilization, while maintaining full field of view in 1080p HD video mode. The sensor's 2 x 2 binning functionality with post-binning re-sampling filter enables 720p/60fps video with minimized spatial artifacts and removed image artifacts around edges. Additionally, the OV5680 can synchronize exposure and frame for stereo cameras to meet 3D video capture requirements.

"With the rise of video-centric smartphones, we have experienced a steep ramp in 5-megapixel sensor demand in the past 18 months, and we are continuing to see strong growth forecasts into 2012, and reports are projecting 5-megapixel production to nearly double within the next three years as smartphones have now overtaken feature phones in the US market," commented Vinoo Margasahayam, product marketing manager at OmniVision.

The OV5680 comes with a standard 2-lane MIPI interface and fits into 8.5 x 8.5 x 6 mm module. It is now available for sampling, with mass production expected for the first half of 2012.
6:11 AM

Omnivision Announces 1.75um OmniBSI-2 Sensor

...
PR Newswire: Omnivision unveiled OV9770, a 1/6-inch 720p/30 HD sensor for notebooks, tablets and portable media players. The sensor is the first to be based on 1.75um OmniBSI-2 pixels and uses 300mm 65nm process. "Over 50 percent of notebooks are already equipped with HD resolution cameras. We believe the key driver for continued HD camera market growth is sensor performance. The OV9770 therefore sets a new quality standard for HD video capture in 720p by combining our strongest current low-light performance (SNR10) with our highest available sensitivity and dynamic range," says Nicholas Nam, director of product marketing at OmniVision.

Compared to the first-generation OmniBSI pixel, the new pixel is said to offer a 20% improvement in peak QE, a 50% in full-well capacity, and a 20% improvement in low-light performance.

The OV9770 is currently available for sampling and is expected to enter mass production in the fourth quarter of 2011.
6:49 AM

Samsung Proposes Convex BSI Diodes

...
Samsung patent application US20110193147 proposes BSI pixel with convex etched shape of photodiodes on the back side:


The planarisation layers 150 and 170 help to keep color filters 160 and microlens 180 flat in this embodiment. Other versions omit layer 150, so that color filter follows the PD shape.

The manufacturing process includes etching out the islands like this:


and then melting them into a spherical shape using "a thermal process":

6:38 AM

Toshiba Reveals More Details about its 1.12um BSI Pixel Sensor

...
Toshiba updated its web site and published more info about its new 1.12um BSI pixel-based sensor. The full sensor lineup of 2011 spans from VGA to 14MP:


Another way to look at the lineup is here, including all sensor's flyers. Talking about the T4K05 8MP 1.12um pixel sensor, its brief spec (link fixed, thanks to comments!) says that the sensor supports "WDR function which can make images or movie with high dynamic range". The sensor is able to fit into 7.5 x 7.5mm module which is quite an achievement. The frame rate is 30fps at full resolution. The DR and SNR are not stated. The chip integrates lens shading and defect pixel correction, VCM driver, temperature sensor and two PLLs (2nd one is for MIPI output).
8:20 AM

Sensorgen Gives QE, Full Well and Read Noise for Many Cameras

...
Sensorgen.info maintains a table summarizing QE, full well and read noise for many consumer and professional cameras. It's somewhat similar to It uses the data from DxOMark, and calculates just the above three parameters across a large set of cameras by Sony, Canon, Olympus, Samsung, Pentax, Nikon and many others.

Thanks to NE for sending me the link!
5:56 AM

abbrevation or full form of B&W and MAN.

...
MAN - MASCHINENFABRIK-AUGSBURG AG ( M.A.N)
The abbrevation of MAN is what found  atlast.

B&W - BURMEISTER & WAIN
B&W Abrrevation or full form.


..............
M❤K
    .::"A COMMON MAN WITH A COMMON THOUGHT'S !"::.

5:33 AM

guidelines to mmd exams at india

...

Before going to MMD, CHENNAI you need to BOOK online for your exam slot.
You need to HAVE A SOFT COPY of your RECENT PHOTOGRAPH inorder to UPLOAD while BOOKING ONLINE and a DD of the Respective amount which should be: Drawn only from the Nationalised Bank in favour of "The Principal officer, Mercantile Marine     Department, Chennai", payable at Chennai.

Documents At MMD for CLASS IV PART B.
After going to MMD, In-Person ask the Respective people for the list of checklist to check by yourself. She/He will be giving an FILE OF FORM’s.
You need to write Your MONTH/year of exam, and subjects, and Advance Courses which you had done, and Four signatures in the respective boxes, ERS, SEA SERVICE in the MMD FILE which SHE/HE gave to you.
In the SEA SERVICE the NATURE OF DUTY is more important for the INDIAN, SEAFERER’s. You need to enter the NATURE OF DUTY in the SEA SERVIC PAGE OF MMD FILE.
Make sure you entered right Day’s, Month’s, Propelling Day’s (QSS in Sea Service Forum).
Once, all the written work is done.
Then along with 5 Photographs, and Xerox copies with ATTESTED and Originals, Admit Card, Drop it in the Drop box as a FILE.
(Drop Box will be opened Twice in a day, @ 10.30am and 2.30pm respectively)
Original Documents which we need to submit are:
1.EXN-45
2.Letter from Indian Agents ( Sea Service )
3.Medical Certificate issued by Approved Doctor.
4.TAR BOOK
Xeror Copies With Attested:
1.     CDC
2.     Preparatory Courses Certificate
3.     Simulator Course Certificate
4.     Modular Course : AFF, PSCRB, MFA, PSSR
5.     SSC / Degree Certificate
6.     Pre Sea Training Certificate
7.     INDOS slip
8.     Passport Copy  * All documents must be ATTESTED mandatory *



ADMIT CARD
1.     You have to affix a Photo Graph to the Admit card and Enter the month and year, Name and details.
2.     Leave blank about the Receipt Number and so on.

....
This is done just to have a checklist before entering in to it.
Like 6 photographs and attestation of the documents and sea service letter format from the company and online booking.
This is as on Aug, 2011. I am not sure may be some changes would have done here after. Here is a common things which are mandatory though any changes take place at MMD, Chennai.
This is up to my knowledge just to guide the upcoming engineers who are going to book for exams.
“ If this violates any rules and regulations do please inform by mail it will be considered.”
*****************************************************
MEO examination for part a or b checklist
 Download.::MK::.
Online seat booking for examination
 Download.::MK::.
Instruction to online seat booking for examination
 Download.::MK::.
*****************************************************




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BAE Systems Imaging Solutions Offers sCMOS Sensor for All

...
BAE Systems Imaging Solutions - Fairchild Imaging introduces scaled-down version of its scientific CMOS (sCMOS) sensor. The new CIS1021 has 6.5um pixels in a 1920x1080 format and is based on the same 5T pixel structure previously released in the 5.5MP CIS2051 sensor, initially available to its development partners Andor and PCO. Now sCMOS sensor seems to be open to a wider range of the customers, such as Photonic Science (UK), Lavision, and others.

The new sensor is said to have <1.2e readout noise, >55% QE, dark current of <10pA/sq.cm at 20C, provides greater than 88dB of intra-scenic DR and produces images at rates up to 100fps in rolling shutter mode or 50fps with global shutter, booth at full resolution. PRNU is specified at <3% RMS, full well is 30,000e-, image lag is 0.1% of maximal output, MTF at Nyquist is 0.4.


Incidentally, Laser Focus World published a comparison article on low-light imaging with ICCD, EMCCD and sCMOS sensors, written by Michael Buchin, president of Stanford Photonics. The author seems to favor sCMOS approach.
10:42 PM

Delft University Repository News

...
Delft University repository is updated with few new image sensor publications:
  1. Noise in Sub-Micron CMOS Image Sensors
    Xinyang Wang's Thesis, Nov. 2008
    The 175-pages thesis mostly contains previously published stuff covering 1/f, RTS, thermal and other noises commonly observed in pixels. Also discusses buried-channel SF design. Written under A. Theuwissen's supervision.

  2. Charge-Transfer CMOS Image Sensors: Device and Radiation Aspects
    Padmakumar Ramachandra Rao's Thesis, May 2009
    Too written under A. Theuwissen supervision. Covers both 4T CMOS and CCD devices. Nice device physics introduction.

  3. Charge Domain Interlacing CMOS Image Sensor Design
    Yang Xu MS Thesis, Aug. 2009

  4. New Challenges for CMOS Imagers: Time-Resolved Photon Counting and Multispectral Detection
    David Stoppa, Lucio Pancheri, Matteo Perenzoni
    FBK, Italy
    Presented at workshop in Delft University in Dec. 2010. Talks about 32x32 SPAD imager with 25um pixels having 20.8% full factor.

  5. Single-photon Imaging in CMOS
    Edoardo Charbon, Delft University
    Invited paper from Proceedings of SPIE, 2010. Presents a very nice overview of recent works on SPAD imagers.

11:06 PM

Caeleste Announces 4T Pixel with 0.5e Noise

...
Caeleste announced it demonstrates 0.5e on noise in 4T pixel:

"This 4T pixel, in a 0.18µm CMOS technology, has high fill factor and is compatible with frontside and backside illumination. The pixel has a very high charge to voltage conversion. In the present configuration we now demonstrate less than 0.5 electronsRMS read noise in the dark.

We will disclose more details on this proprietary technology at upcoming scientific conferences. We invite interested groups willing to provide independent confirmation of our results to contact us. Applications are in low noise and/or low light imaging, i.e. in virtually all imaging domains.
"
11:29 PM

Lytro Technology to Drive Higher Sensor Resolution

...
DPReview published interview with Ren Ng, Lytro CEO and founder. Explaining the future of light field photography trading higher resolution for wider focusing range, Ren says:

"As well as a scientific and commercial breakthrough, this could cause a technological breakthrough. We've got to the stage where we're seeing 14-16MP sensors for compacts and 20-24MP in larger sensors. It's not technological limitations that are defining that figure, it's a marketing-driven progression. When we went from VGA to 1MP to 4MP sensors, that was technology growth."

"Growth in that underlying industry capacity hasn't stopped, there's just no demand for it. With 14MP, for print or web use, those are enormous images, so there's no great pressure to move on from there. But if you applied the technology being developed for mobile phone cameras and applied it to an APS-C sensor, you could in theory make a sensor with hundreds of millions of pixels - an order of magnitude beyond what we're currently seeing. With such a sensor in a light field camera, we'd be able to measure hundreds of millions of rays of light. Light field technology can utilize and re-invigorate amazing growth in density of sensors."

Ren also claims low light and yield improvements with Lytro tech:

"Light field technology is inherently more capable in low light - we can shoot wide-open with apertures larger than make any sense for conventional photography. And we're not just trying to make enormous pictures. One dead or noisy pixel in conventional photography is expected to result in one output pixel in the final image. In light field photography it translates to a dead 'ray' which won't have as much impact on the final output - the sensitivity to defects from the sensor will go down."
11:20 PM

Himax CIS Sales Growing, Yield, Margins Improving

...
Himax announced its Q2 2011 earnings results. Jordan Wu, the company CEO, comments on the image sensor business status:

"In our previous earnings calls, we talked about wafer foundry capacity shortage for CMOS image sensor which limited our revenue growth in this segment over the past few quarters. Starting from the second quarter, the shortage situation has been gradually alleviated and we have been able to fulfill more customer orders. We expect the capacity shortage to further loosen going forward. We also continue to make wafer level optics (WLO) and wafer level module (WLM) shipments to leading laptop and handset brands."

"Our immediate challenge is to improve our overall gross margin, particularly by bringing up the gross margins of the two fastest growing non-driver product lines: CMOS image sensor and LCOS micro-display.

As we reported in the previous earnings call, our CMOS image sensor, the fastest growing ondriver product line, is suffering from low margin as we are still shipping a relatively high proportion of older generation products, which will gradually be replaced by a newer generation of products with improved cost and margin. While we are confident that our margin in this segment will improve as our customers make the switch, we are seeing third quarter gross margin from our sensor product line still lower than our overall average.
"

"We also mentioned in the previous earnings call that we faced low production yield and certain product rework charges in the second quarter when starting to ship wafer level optics to a leading handset brand for the first time. We do foresee a steady yield improvement in the third quarter."
7:53 AM

e2v Supplies CCDs for Nigerian Satellite

...
OptoIQ: Surrey Satellite Technology Ltd integrated e2v CCDs into a focal-plane array for the NigeriaSat-2 Earth observation satellite, which launched into space on August 17. Developed for the National Space Research and Development Agency (NASRDA) of Nigeria, the satellite will provide Nigeria with satellite imaging for mapping, water resources management, agricultural land use, population estimation, health hazard monitoring, and disaster mitigation and management.

The e2v high-resolution focal plane for the instrument was built with an array of five CCD CCD31-40 imaging sensors. The CCD31-40 8192 × 1 pixel device has 12 µm square pixels with readout via two registers, one above and one below the image region. The registers are split in the middle and terminated in four separate output amplifiers. There are also five multispectral bands that cover the spectrum from 450 to 900 nm.

The focal plane design features e2v's new packaging technique, in which the five devices are mounted in close parallel with each other and co-planar to <10 µm.

"e2v is proud to deliver this innovative image sensor focal plane array to SSTL and equip NASRDA of Nigeria with valuable geographically referenced high-resolution imagery,"says Bertrand De Monte, e2v marketing and applications manager.
7:46 AM

Nemotek Named “Global Entrepreneurial Company of the Year”, Releases VGA Wafer Level Camera

...
Business Wire: Nemotek Technologie, a Morocco-based manufacturer of wafer-level cameras (WLC) and Tessera licensee, announced that it has been named "Global Entrepreneurial Company of the Year" by Frost & Sullivan

"When looking at the large scope of the camera module makers, Nemotek exhibits the high entrepreneurial quality of a leader," said Rajender Thusu, a sensors and instruments analyst for Frost & Sullivan. "The company’s wafer-level camera solution delivers both universal and customized solutions for a highly acclaimed end user-experience for a variety of applications including mobile and smartphones, notebooks, medical and security. Nemotek now joins a prestigious list of organizations that have demonstrated leadership and cutting-edge innovation. It is a ‘company to watch’ and look forward to what Nemotek produces in the future."

Nemotek announces mass production of Exiguus, a VGA WLC which integrates wafer-level optics with CMOS sensors. The Exiguus H11-A1 camera offers the thinnest form factor in Nemotek’s product portfolio, featuring 1/10 of inch.
3:35 AM

Albert Theuwissen's CMOS Sensor Courses Schedule

...
Albert Theuwissen's public courses schedule is announced till 1H 2012 - an excellent source of imaging eductation:

Digital Camera Systems
September 26-29, 2011
Copenhagen, Denmark

Basic Introduction to CMOS Sensors
October 26-27, 2011
Munich, Germany

Hands-on Evaluation of Image Sensors and Cameras
November 14-15, 2011
Dresden, Germany

Advanced Course on Image Sensor Technology
November 16-17, 2011
Dresden, Germany

Digital Imaging : Image Capturing, Image Sensors, technologies and Applications
November 28 - December 2, 2011
Barcelona, Spain

Basic Introduction to CMOS Sensors
March 8-9, 2012
Neuchatel, Switzerland

Digital Camera Systems
March 26-28, 2012
Copenhagen, Denmark

Advanced Course on Image Sensor Technology
April 16-18, 2012
Cambridge, United Kingdom

Digital Imaging : Image Capturing, Image Sensors, technologies and Applications
May 21-25, 2012
Dresden, Germany
2:30 AM

things before exams you have to know.

...
I just had a short information to all the upcoming engineers who are going to appear for the class iv MMD exams.
First step do make and account in the www.dgshipping.com its an free account with your INDOS no and a password. This is the main source for all the marine engineering or any one easy way to update to mmd or ilo. keep update your experience and certificates you recieved.
Once, after the pre sea training you need to go for an post sea training for more than 6months.
Its much better to have atleast two or more days than required.
you need to additional courses after your pre sea training.
1.AFF
2.PSCRB
3.ERS
4.MFA

Important: Dont forget to get your sea time from your chief engineer.

On completion of your advacned courses you can go for class iv examination. . at you convinient MMD, India.
i will make you more clear about the exams and so on asap.






Telugu Songs Online .::MK::.

Vision Research Announces 1MP 16,000fps Camera

...

PR Newswire: Vision Research unveils Phantom v1610 camera said to be the world's fastest 1 megapixel camera, 60% faster than any other camera on the market, up to 16,000fps at full resolution. The camera features custom designed 1280 x 800 resolution CMOS sensor with 28um pixels. The sensor's I/O speed is 16 gigapixels/second.

12:47 PM

Right Hand Rule and Left Hand Rule.

...

Left Hand Generator Rule:

Can be used to to determine the relationship of the motion of the conductor in a magnetic field to the direction of the induced current. To use the left hand rule, place the thumb, forefinger, and center finger at right angles to each other. The forefinger points in the direction of the field flux, assuming that magnetic lines of force are in a direction of north and south.. The thumb points in the direction of thrust, or movement of the conductor, and the center finger shows the direction of the current induced into the armature.

Here is a easier way to remember this:

Thumb = Thrust

Forefinger = Flux

Center finger = Current

 

Right Hand Motor Rule:

Used to determine the rotation of the armature when the magnetic field polarity of the pole pieces and the direction of current flow through the armature is known. The thumb indicates the direction of thrust or movement of the armature. The forefinger indicates the direction of the field flux assuming that flux lines are in a direction of north to south, and the center finger indicates the direction of current flow through the armature.

Here is a easier way to remember this:

Thumb = Thrust (direction of armature rotation)

Forefinger = Field (direction of magnetic field)

Center finger = Current (direction of armature current)

..............

                                                     (¯`'•.¸(¯`'•.¸† .::ManindarKumar::.  †¸.•'´¯)¸.•'´¯)
          .::"I have no money, no resources, no hopes. I am the happiest man alive !"::.

       



3:20 AM

Rambus Starts Computational Sensing and Imaging Project

...
Business Wire: Rambus announced the appointment of David Stork to Rambus Labs where he’ll spearhead the development of the company’s computational sensing and imaging initiative. Dr. Stork is an expert in optics and algorithm development. His honors include being named a Fellow from the International Association for Pattern Recognition.

“Dr. Stork’s expertise in optics and computational sensing, imaging and pattern recognition makes him an ideal leader for our long term research efforts in imaging systems", said Dr. Gary Bronner, vice president of Rambus Labs.

Over the course of his career, Dr. Stork has held many corporate research and academic positions, resulting in 40 patents and numerous books, journal papers, invited papers and plenary talks in journals and conferences. Dr. Stork has also held faculty positions as well as visiting professor and lecturer positions at Boston University, Clark University, Stanford University and Swarthmore College.

1:24 PM

plastic manufacturers guide of Rotational molding process

...

manufacturing of plastic water tank
1) Introduction of the product


Today in the world, when you look in the market plastic water tank are very competitive, highly selling and popular product. There are several reasons for it competitiveness.
  • Shortage of water supply of government pipe lines.
  • In rural areas pipe line water supply facility is not provided.
  • Still people use natural water resource.
Because of above reasons to store water, plastic water tanks consumed highly.
For that higher consummation plastic water tanks should have special qualities.
The qualities are,
  • Easy to install.
  • No corrosions and highly hygiene.
  • Low weight.
  • Long life (able to with stand for UV rays).


    Add caption













2) Chosen product details
Under the plastic water tank production in rotational moulding, the chosen product details are given below.
Specification
Details
Water tank type
PE + Premium
Brand
**************
Capacity
500 liters
Total height
Diameter
Gross weight
14 kg
No layers
double layer
1st layer – black
2nd layer – white
Used material
LLDPE-Food grade
1st layer – thickness
2nd layer – thickness
Inlet hole diameter
Outlet hole diameter
Over-flow hole diameter
Top hole diameter
Top hole closing type
Plastic cap with thread













 
3) Manufacturing Process
The principle of rotational molding of plastics is simple. Basically the process consists of introducing a known amount of plastic in powder (granular) or form into a hollow, shell-like mold. The mold is rotated and/ or rocked about two principal axes at relatively low speeds as it is heated so that the plastic enclosed in the mold adheres to the mold and forms a monolithic layer against, the mold surface. The mold rotation continues during the cooling phase so that the plastic solidifies. When the plastic is sufficiently rigid, the cooling and mold rotation is stopped to allow the removal of the plastic product from the mold. 



3.1 Introduction to rotational moulding


Rotational molding, known also as rotomoldingor, rotocasting, is a process for manufacturing hollow plastic products. For certain types of liquid vinyls, the term slush molding is also used. Although there is competition from blow molding, thermoforming, and injection molding for the manufacture of such products, rotational molding has particular advantages in terms of relatively low levels of residual stresses and inexpensive molds. Rotational molding also has few competitors for the production of large (> 2 m3) hollow objects in one piece.



The figure12.42 shows the moulding process called "Slush moulding process". The material filled to the mould, heated until liquid, pour out excess material, undergo for cooling and it forms uniform solid layer of plastic. In rotational moulding, and above "Slush moulding process" is developed.

 
Let's consider the developed method.


 
In the picture in your left hand as same as "Slush moulding process" material is filled to the cavity and heated up to liquid status, but in rotational moulding the cavity and mould rotates in certain speed and forms a uniform layer of plastic. This method leads to manufacture hollow plastic products very easily. Rotational molding is best known for the manufacture of tanks but it can also be used to make complex medical products, toys, leisure craft, and highly aesthetic point-of-sale products.
   
Reasons for using rotational moulding in manufacturing plastic water tanks.
  • Complex parts can be moulded without need for post-assembly.
  • Low machinery and material cost relative to production capacity.
    See the given graph below



  • Double or more walled items can be produced.
  • Ease of colour and material change.
  • Minimum wastages.
  • High production capacity on selected parts.
Lets discuss about manufacturing process of selected item in rotational moulding manufacturing process under capter 3.2 Manufacturing process in detail
  
The main attractions of rotational molding are:
  • A hollow part can be made in one piece with no weld lines or joints
  • The end product is essentially stress-free
  • The molds are relatively inexpensive
  • The lead time for the manufacture of a mold is relatively short

  • Short production runs can be economically viable

  • There is no material wastage in that the full charge of material is normally
  • consumed in making the part

  • It is possible to make multilayer products

  • Different types of product can be molded together on the one machine

  • Inserts are relatively easy to mold in

  • High quality graphics can be molded in

The main disadvantages of rotational molding are:
  • The manufacturing times are long
  • The choice of molding materials is limited

  • The material costs are relatively high due to the need for special additive

  • packages and the fact that the material must be ground to a fine powder

  • Some geometrical features (such as ribs) are difficult to mold
  3.2 Manufacturing process in detail
  • Plastic water tank manufacturing process mainly based on rotational moulding method. However it is not very complicated manufacturing method.
    In brief the procedure as following;
  • The Polyethylene material granules are mixed with granules of black colour concentrators. These are extruded and strands are chopped as granules so as to achieve uniform distribution of carbon black.
  • Then above powder is feed in to the mould in the required quantity.
  • After that the burners of the rotational moulding machine are fired and heated around 300℃. Molten powders when rotated in the heat moulds form hollow storage tank. Then the second layer of the water tank manufacture by adding white colour Polyethylene material to the mould.
  • After proper time when tank is ready, the mould is cooled in air removed the product.
  • Then the each product is undergoing for required product quality tests. After tests the product is ready to the market.
  • The basic steps of water tank manufacturing in rotational moulding divide into main four main steps as following;



(a) Material preparation and Mold charging
(b) Mold heating
(c) Mold cooling
(d) Part ejection or demoulding
Above four steps can be visualized as shown in figure below. 






Note – In above manufacturing process, the process of manufacturing the steel mould which is needed in rotational moulding machine is discussed under topic "5.3 Production of the mould ".From here the production starts from (a) Material preparation and Mold charging.
3.2.1 Material preparation and Mold charging
Material preparation
The raw material (LLDPE) or granules which receive for the manufacturing process are not ready to use. The material undergoes to main steps.
  • Grinding the material.
  • Mixing with concentrators.
The grinding process is visualized below.




The material (granules) pours to the grinding head or mill to break into dust particles. After that through the cyclone, remove the larger particles and separate ideal particles for the manufacturing process.






In the grinding process, frictional heat increases the temperature of the metal cutting faces, the individual polyethylene particles, and the surrounding air. Because of that reason the temperature must be controlled so that it does not rise beyond the melting point of the polyethylene or to a critical softening temperature, prior to melting, when the particles begin to adhere to each other. This can cause blockages in the passage of new material entering the mill. 





Grinding temperature has the most significant effect on the quality of the powder. The effect on dry flow and bulk density values are given with respect to the temperature vs Density variation during the grinding process.
Mixing with concentrators.
  • High speed turbo blending
Dry blending is the best way of coloring rotational molding grade powders. It is attractive because cost savings can be made by purchasing bulk quantities of natural material and coloring this as required prior to molding. In this production black and white colour concentrators are used.
Other additives, such as UV modifiers, impact modifiers, thermal stabilizers, and antioxidants are mixed during the dry blending process.
After the above processes the material is ready to use for rotational moulding.


                                                          
Before material process



                                                               After material process
      
Mould charging 





After the material process, the material is feed in to the rotational moulding mould.
The amount of ** kg (details are not given by company) of the processed black colour LLDPE material feed in to the mould.






Then the mould is closed and ready to begin the heating process.
3.2.2 Heating
Let's discuss about the heating process.
Rotational molding begins with powder and then focuses on powder flow, sinter-melting or coalescence, densification, and cooling of the polymer. Heating is most important factor to obtain a good product.
General Anatomy of the Rotational Molding Cycle
Due to the new technology, it is possible to take continuous temperatures at various locations in and around the mold. Figure given below shows these temperatures for the entire heating and cooling cycle for a mold rotating in a near-isothermal hot air oven environment. As noted below, the outside mold surface temperature exhibits a classic first-order transient response to a step change in the environmental temperature. For most mold materials, there should be relatively little difference between the outside mold surface temperature and the inside mold surface temperature.
 
  • The oven temperature nearly increased to 300℃. The below figure indicates the different temperature variations in the oven. 





Heat controlling system panel board which is placed in the machine.



  
 
Characteristics of Powder Flow

 
During the rotational moulding we can see special characteristics of Powder Flow.

 
Rotational molding speeds are quite low, typically about 4 to 20 rev/min. As a result, the powder charge remains as a powder bed near the bottom of the mold throughout the early portion of the heating cycle.

 
This situation can be expressed in the figure given below.








 


 
Heat Transfer Concepts Applied to Rotational Molding



 
Three types of heat transfer occur in rotational molding. Conduction is the transmission of energy between solids. Energy is conducted through the rotational mold wall, through the stagnant polymer powder in contact with the mold wall, and through the polymer as it densifies, cools, and crystallizes against the mold wall. Convection is energy transmission through fluid flow. The heated air in the oven converts its energy through contact with the rotating mold surface, and the air inside the mold cavity is heated and cooled by convection with the inner mold surface, the rotating powder, and the densifying and cooling polymer mass. Radiation is electromagnetic energy interchange between hot and cold surfaces.Although radiation plays a minor role in heating and cooling molds and polymers.

 
Let's discuss about the mold heating .
Heating the Mold

 
Rotational molds are traditionally constructed of relatively thin, high thermal conductivity metals such as aluminum and steel. Typically, the mold absorbs substantially more energy than the plastic. As the mold is heating in a nearly constant temperature air environment, its rate of heating is essentially unaffected by the small amount of thermal heat sinks of due to plastic or the air in the mold cavity. As a result, the mold should exhibit a typical first-order response to a step change in environmental temperature. Mathematically, this is written as a conduction equation:

 
ρcp t dT/dθ= h(Tair– T)

 
Where ρ is the density of the mold material,cp is its specific heat, t is the mold wall thickness, T is its instant temperature, θ is time, Tair is the environmental temperature and is the convection heat transfer coefficient. If the initial mold temperature isT0, the instant mold temperature is given as:

 
(Tair–T)/(Tair–T0) = exp[–hθ/ρcpt] = exp[–hαθ/Kt]

 
Where =K/ρ cp, the thermal diffusivity of the mold material. Thermal characteristics for various mold materials. This model assumes that the temperature across the mold wall thickness is constant and that the heat transfer coefficient on both sides of the mold wall is the same. Technically, there is a thermal lag between the oven surface of the mold and the inner or mold cavity surface. The time at which the inside mold cavity temperature first begins to increase fromTmold,0 is given approximately by:
θ inside ≈0.0156L2/α

 
For all intents, the inside mold surface sees the outside mold surface energy in less than one second. Once the inner mold surface begins to heat, its temperature TL lags behind the outside mold surface temperature TWby approximately:

 
TL≈ TW– h(Tair– TW)L/2K

 
The temperature offset is about proportional to the convection heat transfer coefficient and the thickness and thermal properties of the mold material. High oven air flow, thicker molds, and molds of low thermal conductivity act to increase the temperature difference across the mold thickness. The rate of heating of both mold surfaces become equal when the heating time is approximately:
θ asymptote ≈0.45L2/α

 
The thermal offset across the mold thickness may be only a few degrees at best. The shape of the transient mold heating curve has been verified through measurements on stationary and rotating molds.1–3Table 4.2 lists values for convection heat transfer coefficients for various fluid media. Experimentally, the convection heat transfer coefficient for molds rotating in a hot air oven is on the order of 5 Btu/ft2 hr °F.

Time-dependent temperatures at various points in the molded part



 
Heating Powder & Track Temperature are the other heat transformations occur in rotational molding.
After the oven reach to 300℃, when first layer of LLDPE – black coloured layer formed the machine undergoes the process of forming process of second layer.



 
There is a special door to fill the secondary material into the mould. That is placed on the top of the machine. Before filling the secondary material several controlling steps have to be taken.

 
.
 
Filling white coloured secondary material in to the mould cavity
 
Total oven cycle time
First is the time needed to get the mold to the tack temperature. Since the polymer powder is in contact with only a portion of the mold during this time, this time should be nearly independent of the final part wall thickness. The second is the time needed to coalesce and densify the polymer against the mold surface. And the third is the time needed to ensure that the polymer is fully fluid and all bubbles have collapsed.
Tfinal. If the mold mass is mm and the mold has a heatcapacity of cpm, the amount of energy required is:
Qmold= mm cpm( Tfinal– T0)

 
The amount of energy needed to heat the powder charged to the mold from room temperature to its final fluid temperature,
polymer, final, is obtained from

 
Q polymer=mpolymer ∆hpolymer

 
From above equations we can calculate the Total oven cycle time

 
After that the machine undergoes to the process as same as processing the first layer.
Then the product is ready to perform the next step "Mould cooling"

 


3.2.3 Mould Cooling




In the oven when heating the temperature increased up to 300℃ . As the last main manufacturing process the mould should cool down to the room temperature.

  When mould cooling there are two ways to cool down the mould.
  1. Quench cooling (water cooling)
  2. Slowly cooling (air cooling )

In this production process the method of air cooling(slowly cooling) is used to the mould to the room temperature.

 
Air Cooling



 
Highly powered blower fans are placed under the moulding machine to provide air which required for cooling.
In air cooling the speed and axial rotations of the mould keep as same as mould heating. 
  • Experimental cooling curves




3.2.4 Part ejection or demoulding







Technically, the ideal time for part removal from the oven is immediately after the polymer is fully dandified into a monolithic liquid film uniformly coating them old surface. At that time the product is removed from the mould.
This is the final process of manufacturing plastic water tanks.
   
  • Note - Plastic cap with thread cut is needed component as the lid for the top hole of the water tank . That component is manufactured under plastic injection moulding separately from this process.
  Required inlet and outlet holes are created by using plastic drilling method.
After the quality checking tests the product is ready to distribute to the market.
 
4) Materials used





In plastic tank manufacturing Polyethylene based materials are used such as LLDPE,HDPE,MDPE and etc.
For this production process Polyethylene based LLDPE polymer is use as the material for plastic water tanks.
4.1 Chemical details of material










 
    The polyethylene product used to make all products is an extremely tough and durable lightweight thermoplastic material. The colour and ultra-violet stabilizers are compounded to give long-term resistance and stability to harsh sun. No chemical reactions take place during the manufacturing process and consequently there is no tainting of water with polyethylene. All of our tanks are manufactured using virgin linear low density polyethylene (LLDPE) which complies with AS/NZS2050, the standard for food grade material. The material is recyclable and can be repaired by a heat welding process if damaged.
Plastic, or polyethylene, water tanks are now the biggest selling sector of the water tank market and have been developed and tested in the market place over many years for the manufacture of water storage containers. It cannot rot or corrode, and is UV stabilized.
Water stored in polyethylene has no taste from the tank material because nothing leaches from polyethylene.
Physical properties of LLDPE
Property
Value
Density
0.92 g/cm³
Surface hardness
SD48
Tensile strength
20 MPa
Flexural modulus
0.35 GPa
Notched izod
1.06+ kJ/m
Linear expansion
20×10−5/°C
Elongation at break
500%
Strain at yield
20%
Max. operating temp.
50 °C
Water absorption
0.01%
Oxygen index
17%
Flammability UL94
HB
Volume resistivity
1016 Ω·cm
Dielectric strength
25 MV/m
Dissipation factor 1 kHz
909090
Dielectric constant 1 kHz
2.3
HDT @ 0.45 MPa
45 °C
HDT @ 1.80 MPa
37 °C
Material drying
NA
Melting Temp. Range
120 to 160 °C
Mould Shrinkage
3%

 

 

Structure of LLDP
 
4.2 Applicableness to use the material



  • Flexibility - In addition to UV and chemical resistance, LLDPE geomembranes exhibit a high degree of flexibility. Greater flexibility provides increased conformance to subsidence and differential settlement.
  • Puncture Resistance - High puncture elongation properties make LLDPE liners ideal in applications where conformances to sub grade irregularities increase the possibility of puncture.
  • Reflective Factor - Poly-Flex offers its LLDPE geomembranes in white as well as black. A white surface helps mitigate liner temperature extremes and aids visual inspection.
5) Tooling required
When considering the tooling most important thing is the type of rotational moulding machine, which is using for the production.
Several machine types are following,
  1. Open fired Rock Roll machine.


  1. Close Owen Rock Roll machine.

     
  2. Close Owen single arm single station Machine, 360° moveable mould.

  3. Close Owen three arm three stations Machine, 360° moveable mould.
  4. Shutled machine for mass production. 


Biaxial rotational moulding plant 3 arm or Close Owen three arm three stations Machine, 360° moveable mould is the machine used in manufacturing process.

 
5.1 Basic tools required
Following Tools and machines which are used in manufacture process.
  1. Biaxial rotational moulding plant 3 arm – rotational moulding machine
  2. Chain pulley with stands. – to move heavy loads among the factory area
  3. Pulverizing Machine. – polymer milling machine
  4. High speed mixture. –mix the concentrators with grinded polymer
  5. Weighing machine. – to measure polymer weight
  6. Cutter machine for rejection tanks.
  7. Testing equipments
  8. Moulds.
5.2 Details of required tools.
The details are given only the most important machines for the manufacturing process.
  1. Biaxial rotational moulding plant 3 arm


     

Rotocaster..
 
  • Special design heating chamber for energy efficient heat transfer to the moulds for fast and short cycle time.
  • Insulation material for better working environment.
  • Straight arm with two spacious spiders (optional) to accommodate different size moulds for convenient working.
  • Straight arm with four mould individual carrier for uniform thickness.
  • Provision for second/third charging manhole on the top of oven for charging polymer without opening the oven doors.
  • Oven controls are equipped with necessary interlocking and safety devices with alarm
  • Micro processor based machine control panel  with digital display.
  • Enclosed cooling chamber with high performance industrial cooling fan.
  • Variable speed a/c drive for major and minor speed.
  • Mould positioning and balancing facility inbuilt
  • Environment friendly burner suitable for lpg/cng/oil/duel fuels.

Layout of the machine 





  
 
2) Pulverizing Machine (single mill)
This machine is needed under "3.2.1 Material preparation" to grind the material.



  
  
  
Disc & mill body:
  • The disc is made from graded material tested quality and dynamically balanced for smooth running. Inspection windows (2 nos.) Are provided on both side of mill body for visually checking the  disk gap and assist the gap setting. Several options are available to simplify the cleaning process. Long service life of the discs between resharpenings.
  • Cooling:
For mill body, bearing housing and mill door for better result.
  • Bearing housing:
Bearing housing water cooled.
  • Metal detector:
High efficeincy hopper magnet provide with the m/c. To detect the metalic inclusion parts from the polymer. Optionally, metal detector sensor will be provided on request.
  • Feeding:
Feeding hopper showing low level indicator. Auto tripping system available in case of overload feeding. Main motor ampere and feeding device synchronized  to avoid tripping of motor due to over feed
  • Cyclone:
  • Our cyclonic system is well designed for easy cleaning. With bag filter (on request)arrange ment.
  • Hopper loader:
  • Pneumatic hopper loader will provide on request
  1. High speed mixture



     
    This machine is needed under "3.2.1 Material preparation" to Mix grinded polymer with concentrators
    • Capacity 25 to 100 kg per batch. For granule
    • Capacity 25 kg to 100 kg. Per batch for resin with pigment powder
    • Moisture free blending and compounding with additives in different controlled temperatures.
    • Stainless steel inner vessel and graded mild steel outer jacket provided with temperature sensors for monitoring the powder temperature and water jacket to avoid clotting of the resin during process.
    • Process control timer   switch to set and monitor the process.
    • Provision for on line additives or pigment adding facility and breather valves on the lid.
    • Pneumatic controlled powder discharge and lid opening arrangement.
    • Digital display of powder temperature and water jacket temperature. With hooter /alarm for process timing indication..

     
Above mentioned machines are the most important machinery for manufacturing process.
5.3 Production of the mould
In this production process the metal mold is not manufactured by the water tank manufacturing company. The mould is manufactured by another company according to water tank manufactures' configurations.
Mostly these moulds are made from Aluminum ,Carbone steel or stainless steel sheet metal.
For this process the stainless steel moulds are used.

 
Process of manufacturing the mould



 
By using computer designed drawings sheet metal is cut and bended.
 
to obtain the cylindrical shape the metal sheet is fed 


 
Argon welding and pilot torch welding is used to fix all parts of the mould. 






Buffing process is needed to obtain perfect smooth finish of the mould





 

The mould is ready to use for manufacturing process.



 


6. Costing
Costing for the product can be calculated as following.
Cost type
Costing criteria
Total(LKR)
Material cost
LLDPE+other material 1kg=150.00
150×14=2100.00
Labour cost
50%Material cost= Labour cost
1400.00
Overheads
100% of material cost
2100.00
Net total
5600.00
Profit
40%
2240.00
Final cost
7840.00

 
Approximate retail selling price = 8500.00- 8900.00 LKR
7. Quality Considerations .
All the manufactured tanks undergo for product quality tests and obtained local and international level quality certificates.
This product has awarded following quality certificates
  • ISO 9001
  • SLS 147
  • SLS 659
  • SLS 935
8. Possible Defects may arise during the products manufacture.
With the new technology manufacturing defects are highly minimized .
But some defects can occur
  • When heating the moulding the air bubbles will appear in the liquidized material and it will create patches and damage to the surface finish.
  • In cooling cycle errors may occur and that will damage to the product strength.