- Drivers for Vision based Applications in the Automotive Environment
Heinrich Gotzig, Valeo Master Expert, Valeo Schalter und Sensoren GmbH - The direction of CMOS image sensor evolution.
Teruo Hirayama, Corporate Executive/ Pesident of Device & Material R&D Group, Sony Corporation - Camera module technologies and trends comprising assembly technologies, testing, and automation
Kathrin Rieken, Design Engineer, Jabil Optics Germany GmbH - Driving by numbers
Richard Bramley, Safety Architect, NVIDIA - Why image quality KPIs are a must for digital camera tuning
Nicolas Touchard, VP Marketing, DxO Labs - Next Generation Human Activity Sensing For Smart Buildings
Guillaume CROZET, VP Sales & Marketing, IRLYNX - Introducing vivaMOS - a CMOS image sensor spin-out from Rutherford Appleton Laboratory (RAL)
Dan Cathie, CEO, vivaMOS Ltd - Enhanced features of camera modules using ultrasonic ceramic motors
Jean-Michel Meyer, CEO, miniswys SA - Design strategies for low cost infrared cameras
Guillaume DRUART, Research Scientist, ONERA - Is there anything beyond? Terahertz imaging: potential and perspectives
Matteo Perenzoni, Senior Researcher, FBK - Democratization of optical spectroscopy for material analysis
Damian Goldring, CTO, Consumer Physics Inc. - A compact, 4 channels fluorescence imaging acquisition system with no moving parts for molecular biology applications.
Marco Bianchessi, R&I Manager, STMicroelectronics - Innovation in imaging on sensors, spectral filters, software and vision systems
Maarten Willems, business director, imec - Analogue and Digital Pixels for Time Resolved SPAD Sensors
Robert Henderson, Professor, University of Edinburgh - Neural Networks for Industry 4.0 : Analytics at the edge of the network
Philippe LAMBINET, CEO, Cogito Instruments SA - Event-Driven Sensing and Processing for Vision
Bernabe Linares-Barranco, Reseacher, CSIC - PRE-PROCESSING OF IMAGER DATA FOR 3D TOF IMAGING
Beat De Coi, CEO, ESPROS Photonics AG - A scientific HDR Multi-spectral imaging platform
Benoit Dupont, Business Development, Pyxalis - Optimization of CMOS image sensor utilizing Variable Temporal Multi-Sampling Partial Transfer Technique to Achieve Full-frame High Dynamic Range with Superior Low Light and Stop Motion Capability
Salman Kabir, Systems Engineer, Imaging Division, Rambus - Zero delay Focus with poLight TLens
Jacques Dumarest, System Principal Engineer, poLight - CMOS Image Sensor Scaling Enabled by Direct Bond Technology
Paul Enquist, VP 3D R&D, Invensas - Advanced Wafer Level Chip Scale Packaging Solution for Industrial CMOS Image Sensors.
Jérôme VANRUMBEKE, Profesionnal Imaging Sensors Project Manager, e2v Grenoble - High Dynamic Range (HDR) stereo camera system for applications in robotics
Markus Strobel, Head of Department Vision Sensors, Institut für Mikroelektronik Stuttgart - Deep submicron CMOS for novel types of smart image sensors
Peter Seitz, Adjunct professor of optoelectronics, EPFL - Institute of Microengineering
Imaging Conference at SEMICON Europa
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SEMICON Europa is to be held in Grenoble, France on October 25-26, 2016. The Imaging Conference at the event has quite an impressive image sensor agenda:
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