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EETimes: Microsoft says that HoloLens processing unit (HPU) fuses input from five cameras, a depth sensor and motion sensor, compacting and sending it to the Intel SoC. It also recognizes gestures and maps environments including multiple rooms. The TSMC 28nm HPU packs 24 Tensilica DSP cores and 8MB cache into a 12x12mm package with 65M transistors. A GByte of LPDDR3 is included in the HPU’s package.
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