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Ziptronix has signed a licensing agreement with Sony for the use of Ziptronix’s patents regarding oxide bonding technology for BSI sensors. “
We believe that Ziptronix’s patented oxide bonding technology, called ZiBond, enables the industry’s lowest distortion for imaging systems utilizing backside illumination” said Dan Donabedian, CEO of Ziptronix, Inc. “
The result is that pixels can be scaled smaller, resulting in more die per wafer. Users of ZiBond technology benefit because yields are dramatically improved and production costs reduced.”
“
Our patented bonding technology revolutionizes how light is received in imaging sensors. This is critically important for backside illumination applications,” said Donabedian. “
The market for image sensing products is expected to exceed $16 billion cumulative over the next four years. Because ours is an innovative, enabling technology, I expect Ziptronix to play a leadership role in the backside illumination space as well as several other developing markets.”
No Sony comment is quoted in the PR.
Update: EETimes publishes an article on Ziptronix licensing deals.
The proprietary ZiBond process was a breakthrough in that using a very thin layer of dielectric facilitated direct bonding of multiple materials in previously impossible combinations, according to Ziptronix. Ziptronix has received approximately $45 million in investments from three sources: Intersouth, Grotech; and RTI International, a independent-nonprofit R&D organization.
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