Areas of interest include, but are not limited to:
- Pixel device physics (New devices and structures, Advanced materials, Improved models and scaling, Advanced pixel circuits, Performance enhancement for QE, Dark current, Noise, Charge Multiplication Devices, etc.)
- Image sensor design and performance (New architectures, Small pixels and Large format arrays, High dynamic range, 3D range capture, Low voltage, Low power, High frame rate readout, Scientific-grade, Single-Photon Sensitivity)
- Image-sensor-specific peripheral circuits (ADCs and readout electronics, Color and image processing, Smart sensors and computational sensors, System on a chip)
- Non-visible “image” sensors (Enhanced spectral response e.g., UV, NIR, High energy photon and particle detectors e.g., electrons, X-rays, Ions, Hybrid detectors, THz imagers)
- Fabrication, packaging and manufacturing (stacked image sensors, back-side illuminated devices)
- Miscellaneous topics related to image sensor technology
Submission Deadline: February 28th, 2015
Targeted Publication Date: January 2016
Guest Editor-in-Chief:
Prof. dr. Albert Theuwissen, Harvest Imaging, Bree, Belgium, and Delft University of Technology, Delft, the Netherlands.
