Omnivision Quarterly Earnings Call

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Seeking Alpha published Omnivision's quarterly earnings call transcript. Few interesting quotes:

Shaw Hong, CEO:

"...we recorded revenues of $185 million... On a non-GAAP basis, gross margin was 24.7% and net income was $7.4 million.

...we introduced a second next generation piece of architecture called OmniBSI+... this new architecture gives us the opportunity to maximize the utilization of our 8-inch wafer capacity."

Ray Cisneros, VP WW Sales:

"...we shipped 143 million units as compared to 153 million units in our prior quarter. The average selling price in our fiscal third quarter was $1.29 as compared to $1.42 in the prior quarter. The step-down is due to a reduction in higher resolution sensor product mix.

...VGA represented approximately 59% of total shipments as compared to 53% in the prior quarter."

Anson Chan, CFO:

"The decrease in margin is really attributable to decrease in ASP as well as the shipment of inventory that we built up accumulated in the past two quarters. The cost basis of these items are relatively high because we’ve build them before we had the chance to improve the yield and get some pricing cost reductions. On a cost basis essentially we’re locked in at the time when the inventory avenues were built.

And on top of that the yield issues that we ran into in prior quarters, when we first built our 8-megapixel OmniBSI-2 products and that translated into additional costs during the third quarter."

PR Newswire: Omnivision ended the period with cash, cash equivalents and short-term investments totaling $236.5 million, a decrease of $228.3 million from the previous quarter. The decrease includes approximately $100.0 million in cash used for the repurchase of the Company's common stock. The decrease also includes approximately $26.0 million in cash paid to VisEra for the acquisition of the CameraCube production operations from the entity during the second quarter of fiscal 2012.

Based on current trends, the Company expects next quarter revenues will be in the range of $195 million to $215 million.

MSNBC: Omnivision's revenue surpassed Wall Street estimates, and the company also forecast a better-than-expected fourth quarter. Its shares jumped $1.97, or 12 percent, to $18.05 in aftermarket trading.

Update: Here is Oppenhemer's analysis of Omnivision results:

Positives: The beat on revenues for F2Q12 and much better than expected guide on revenues/EPS for F3Q. OVTI is doing well in the entertainment (tablet +) category and expects to pick up in the smartphone category as well in the coming quarters. Automotive design wins in Japan also impress. Windows 8 tablets to come.

Negatives: Worries persist on whether BSI-2 yield problems are truly fixed when emphasis was put on OmniBSI+ on 8" platform during the prepared remarks. This will continue until a marquee win is achieved. Also, "Cameracube" capacity is currently under-utilized but will be used better in 2H12.
11:59 PM

ISSCC: NHK Presents 8K 120fps Super Hi-Vision Sensor

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NHK presents Super Hi-Vision 8K TV sensor capable to shoot at 120fps speed. NHK has partnered with Shizuoka University to develop the new fast readout circuits. The sensor is being presented at ISSCC these days.


Update: Tech-On gives more details about the NHK sensor. The sensor is built in 0.18um process and has 2.8um pixels.

In order to achieve high speed at low power the cyclic column-parallel 12b ADC uses a two-tiered architecture. The first ADC resolves 4b, and the next stage delivers the rest 8b. The power of the ADC is 800mW.

11:45 AM

ST Reveals OIS for Cameraphones

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PR Newswire release is titled "STMicroelectronics Shows Unique Metal Alloys Improving Cameraphone Pictures and Other Innovative Solutions for Comprehensive Mobile Experience".

ST reveals a new approach to OIS in mobile phones, more specifically, a new mechanical actuator that compensates for slight movements of the user's hand. The new technology uses actuators made of Shape Memory Alloys (SMA) that are able to contract upon heating. Small size and low power requirements allow SMA "smart materials" to be used in actuators that are dramatically more compact, lighter, more powerful and quiet that will replace alternative technologies based on Voice-Coil Motors and piezoelectric elements that cannot meet the size constraints of mobile phones.
11:37 AM

ISSCC Report - Day 2

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Albert Theuwissen continues his excellent reports from ISSCC. The recent one talks about two different approaches to combined RGB/ToF sensors, both presented by Samsung.
8:05 AM

LSST 3.2 Gigapixel Camera to Become World's Largest

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The Large Synoptic Survey Telescope (LSST) camera is supposed to be the largest digital camera ever constructed. Its size of 1.6 meters by 3 meters is roughly equal to that of a small car and it will weigh 2800 kilograms. It is a large-aperture, wide-field optical (0.3-1 μm) imager with image surface diameter of approximately 64 cm. The detector format will be a mosaic of 189 16MP CCDs providing a total of approximately 3.2 Gpixels. Each CCD has 16 outputs and is based on 10um pixel. The frame rate is 0.5fps, giving it a speed of 1.6GP/s.


LSST compiled a comparison of large cameras today:


Unfortunately, the schedule of LSST camera is quite long, the camera is supposed to be ready in 2020. I doubt it will be the largest by that time:


Actually, the recently constructed 0.5m x 1m 1GPixel Gaia camera is even larger in area, but lower in resolution.
6:56 AM

Omnivision Split-Diode HDR Sensors Go to Mass Production

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PR Newswire: OmniVision announces that its automotive advanced driver assist sensors, the OV10630 and the OV10635, have both received AEC-Q100 Grade 2 qualifications. Both sensors are built on 4.2um OmniPixel3-HS pixel architecture with sensitivity of 3.65V/lux-sec. The sensors use OmniVision's split pixel technology, in which the information for the HDR multi-capture is sampled simultaneously from the scene rather than sequentially, minimizing motion artifacts. They provide fully-processed, display-ready 720p/30 color HDR video output in 8- or 10-bit YUV format, or 10- to 18-bit combined RAW RGB HDR output with complete user control over formatting and data transfer. Unprocessed RAW data is also available in two 10-bit format images.

The OV10630 comes in an 11 mm x 11 mm CBGA2 package, while the OV10635 is integrated in a 7.8 mm x 7.1 mm aCSP package. Both are now available in high-volume quantities.
11:11 AM

Polight and Movidius Jointly Demo 3D Camera

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Polight and Movidius jointly demo 3D camera at MWC in Barcelone this year. "Integrating poLight TLens has enabled us to significantly increase the speed and performance of our new 3D mobile camera demonstration," said Sean Mitchell, CEO at Movidius. "In addition to the faster AF speed, synchronizing the two cameras using the TLens dramatically improves the 3D performance compared to traditional VCM, showcasing our high quality 3D multimedia features."

"I am very pleased to see that TLens speed and the easy synchronization methods can remove a barrier to reaching high quality 3D video capture," said Christian Dupont CEO of poLight.

Update: Optics.org: In an unrelated PR poLight announced that it has collaborated with TI to produce in large volume the Optical MEMS part of its TLens, resulting in faster focus time and lower power consumption.

"Texas Instruments with their MEMS engineering expertise and their worldwide manufacturing operation significantly strengthen our ability to serve our camera module customer demands," said Christian Dupont, CEO of poLight.

Texas Instruments worked very closely with poLight to develop a process that met the device performance needs while at the same time met cost goals. "The new TLens device from poLight AS benefits from TI’s advanced MEMS development and processing expertise along with TI’s experience in very high volume manufacturing," said Faa-Ching Wang, manager of the Heater Chip Business Unit at Texas Instruments. "TI and poLight have collaborated on this innovative device that will help bring greater autofocus performance and functionality to camera phone applications."
11:00 AM

The Oldest Car "Alive"

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He was Marquis Albert De Dion who does genius and as a pioneer in many automotive industrial. He understood the potential development of gasoline engine.

Before era of internal combustion engine, together with George Bouton he created steam engine in 1882, and to increase performance of engine work, they created shaft back system. In 1890 they created gasoline engine and continuo to created car with three wheels.

Back in 1884, De Dion and bouton created a steam power car which can take 4 passenger, two in front and two others in behind. All control of car is by hand.

©AutoExpert Magazine
3:52 AM

The Last Gasoline Standing

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The world of automotive era now is coming from internal combustion engine (ICE) model. Those machine consist two choices, diesel engine and gasoline engine and the gasoline consist two types, two strokes and four stroke.

In their expansion the four stroke defeat two stroke cause by emission gas. But in four strokes engine also has problem of mechanical & process loss. That is only 40% remain power to turn the wheel.

Totally there are six loss of four strokes engines,
1. Compression Ratio loss.
The compression ratio can not be increase due to tendency to knocking caused by the rapid increase temperature of combustion chamber.


2. Air-Fuel Ratio (AFR) loss.
To created ideal comparison of air-fuel ratio and how to mixture of them is not easy.

3. Combustion Period loss.
How long the mixture of air and fuel.

4. Combustion Timing loss.
How can to define the ignition time, if not right knocking can created.

5. Pumping loss.
The condition where camshaft can not created opening and closing valve as a variation of load engine. This problem solved by variable camshaft.

6. Mechanical loss.
This is about friction.


Mazda Skyactiv claim that they can decrease consumption of gasoline until 15% or equal to modern diesel engine.

Also the torque power can increase until 15%. So 60% of gasoline engine loss can be taken back.


Mazda Skyactiv solution to answer the six losses are high compression ration can created high temperature at combustion chamber so the fuel can ignition by itself before ignition of spark plug.

The effect of that the engine will loss of torque power. Mazda Skyactiv install the exhaust system with 4-2-1 to reduce the temperature . This system is effective in reducing emission gas flow from one cylinder to another cylinder.


The temperature of exhaust gas can be increase by take slowly of ignition by piston with hole at the center.

Mazda skyactiv fuel injection system can hold the fuel to not enter the combustion chamber before the right time.

This hold time is using to mixture air-fuel. And the created time of ignition, the tendency of knocking almost impossible happen.

©AutoExpert Magazine.
3:43 PM

Aptina Announces A-PixHS Fast BSI Sensor

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Business Wire: Aptina announces the 8MP AR0833 sensor based on A-PixHS technology. The new 1/3.2-inch 1.4um pixel sensor has the speed to capture the full 8 MP at 30fps speed. The new A-PixHS technology combines BSI pixel with high speed sensor architecture. The pixel's DR is 61.2dB, responsivity is 0.7 V/lux-sec. Designed to enable AF camera modules as small as 8.5x8.5mm with z-height less than 5.9mm, the AR0833 is targeted to mobile devices, including smartphone market, which according to TSR is expected to grow 33% in 2012 and account for 65% of all cell phone shipments by 2015.

The sensor’s high speed enables 1080p/30 HD video with simultaneous still 8MP capturing and rapid context switching which also removes shutter lag when the sensor switches between a low-power preview mode and a full resolution still image. The full operating power is 400mW. Additionally, the AR0833 is HDR ready for still and video applications when coupled with an HDR processor.

The AR0833 is currently sampling and will be available in mass production in Q2 2012. Available as a stand-alone sensor for OEMs and manufacturers who have their own ISP, it is also available with Aptina’s imaging co-processor for a fully tuned, complete camera solution enabling quick integration and delivery of new designs to market.


In a separate announcement Aptina lists the technologies it's going to demo at 2012 Mobile World Congress in Barcelona, Spain from Feb. 27 – March 1, 2012:
  • 1.4um BSI and 1.1um BSI pixels
  • The latest developments in HDR, 3D depth sensing, and other future technologies
  • Advancements for full HD videoconferencing sensors
12:53 PM

Aptina Licenses OTP IP in 65nm TSMC Process

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MarketWire: Sidense announces that Aptina is using Sidense's field-programmable 1T-OTP memory macros for several image sensor and camera module products for the mobile, consumer, automotive and surveillance markets. The 1T-OTP IP is developed for TSMC's 65nm LP process node. The 1T-OTP macros support calibration and optimization of image sensors in a chip, module or system environment.

"Aptina chose Sidense OTP for storing calibration and lens correction information in our image sensor and companion chip products for its small macro area, reliable field programmability to support correction in finished modules, and scalability to new process nodes for future product development," said Sion Quinlan, Aptina's Director of Circuit IP. "Because Sidense's OTP does not add any additional processing steps or masks to our sensor process, Aptina benefits with a cost and time savings."
6:55 AM

ISSCC Report - Day 1

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Albert Theuwissen publishes almost real-rime reports from ISSCC in San Francisco. The first day report talks about medical imaging session papers mostly coming from academic world.
6:40 AM

ISSCC: UT Dallas Shows Single-Chip Terahertz Imager

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EETimes: "We can now build a CMOS image chip for a cell-phone-sized camera module that sees in the terahertz range," said Ken O, a professor and lead researcher at UT Dallas. The key to integration of terahertz imager on-a-chip is the high-speed Schottky diodes fabricated in CMOS. "We have figured out how to create high-speed Schottky diodes in CMOS without changing the process, just the layout," said O. "We just take an active region where a transistor would normally go, and don't draw the source-drain implantation mask layer, resulting in a Schottky diode."

Even at design rules of 130nm used for the demonstration chip, the high-speed Schottky diodes were able to achieve THz-range performance without changing the standard CMOS processing steps.

A one-pixel CMOS terahertz image chip (left) can see through solid objects,
here showing the inner workings of an old-school floppy disk.

The details are presented in a paper "280GHz and 860GHz Image Sensors Using Schottky-Barrier Diodes in 0.13µm Digital CMOS," at the ISSCC this week in San Francisco.

Another similar paper at ISSCC is "A 1kPixel CMOS Camera Chip for 25fps Real-Time Terahertz Imaging Applications" by STMicro, Crolles, France, University of Wuppertal, Wuppertal, Germany and IEMN / ISEN, Lille, France
6:33 AM

Bio-Inspired GE Upconverts 3-8um IR to Visible Green

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Nature Photonics published General Electric's paper:

"Towards high-speed imaging of infrared photons with bio-inspired nanoarchitectures"
Andrew D. Pris, Yogen Utturkar, Cheryl Surman, William G. Morris, Alexey Vert, Sergiy Zalyubovskiy, Tao Deng, Helen T. Ghiradella, Radislav A. Potyrailo

Abstract

"We report an attractive platform of low-thermal-mass resonators inspired by the architectures of iridescent Morpho butterfly scales. In these resonators, the optical cavity is modulated by its thermal expansion and refractive index change, resulting in ‘wavelength conversion’ of mid-wave infrared (3–8 µm) radiation into visible iridescence changes. By doping Morpho butterfly scales with single-walled carbon nanotubes, we achieved mid-wave infrared detection with 18–62 mK noise-equivalent temperature difference and 35–40 Hz heat-sink-free response speed. The nanoscale pitch and the extremely small thermal mass of individual ‘pixels’ promise significant improvements over existing detectors. Computational analysis explains the origin of this thermal response and guides future conceptually new bio-inspired thermal imaging sensor designs."

Transmission electron microscope image of a cross-section
of the Morpho butterfly nanostructure.
ΔR(λ) spectra of the Morpho nanostructure on heating with MWIR radiation. Signal intensity is proportional to the amount of MWIR radiation applied to the nanostructure, with a maximum signal change of ΔR = 5.4% at the steady-state response

See Nature Photonics supplementary materials for the bigger pictures.

Vision Systems Design: Radislav Potyrailo, Principal Scientist at GE Global Research, said that the team is working on the fabrication of photonic nanostructures inspired by Morpho butterfly wing scales, with commercial applications that could reach the market within the next five years. The thermal sensors can sense temperature changes down to 0.02 degrees Celsius, and changes in temperature at a response rate of one fortieth of a second.

Update: GE Research article and Youtube video show the temperature response of "Butterfly light convertor". The official GE PR is here.

12:27 AM

Panasonic Presents SmartFSI 1.43um Pixel Sensor

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Panasonic announces the availability of its MN34110PA sensor based on "SmartFSI" 1.43um pixels. The sensor was first revealed in May 2011 and was said to have the industry's highest sensitivity of 3050 e-/lx/sec/μm2.

The 1/2.33-inch 14.2MP sensor can operate at 18.21fps at full resolution or 60fps in 1080p mode. Its ADC has 12b resolution delivered through sub-LVDS DDR-style I/O. The sensor is intended for DSCs and camcorders.

8:44 AM

Raytrix Presents Lightfield Camera with Quarter of the Sensor Resolution

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Raytrix plenoptic camera presented in Electronic Imaging 2012 paper has an extended depth of field and a maximal effective resolution of up to a quarter of the sensor resolution. In addition the raw image of the camera also contains all the information needed to calculate the 3D form of the recorded scene.

The paper says regarding the works of Ren Ng, Lytro founder: A "reason that it took some time for the plenoptic technology to take hold is that the initial plenoptic camera design, as for example implemented by Ng in 2005, generates refocused images whose number of pixels equals the number of micro lenses. That is, even when using a high resolution sensor with 16 mega pixels, say and a micro lens array with 40000 lenses, the refocused images have a resolution of 40000 pixels. For many applications this is not a practicable resolution."

The paper continues: "a new type of plenoptic camera is introduced here, called the multi-focus plenoptic camera (MFPC), whose micro lens array consists of micro lenses with different focal lengths. A MFPC can therefore be regarded as a number of interlaced single focus plenoptic cameras. It is shown that a MFPC extends the depth of field compared to a single focus plenoptic camera and still allows effective lateral resolutions at up to one quarter of the sensor resolution."
5:09 AM

Samsung Presents BSI ToF Sensor

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The updated Samsung Imaging web site lists BSI ToF sensor, the S5K32A. The previously shown ToF sensor had different part number S5K32D, and does not mention BSI technology. I'm not sure why one needs BSI for an IR sensor having 14um pixel size, but probably there is a reason. The QVGA 1/3-inch ToF sensor is said to have embedded depth output processing.
2:47 AM