TI introduced the DRV201 - industry's first auto focus voice coil driver with both pulse width modulation (PWM) and linear current regulation support. The 0.15mm-slim packaged chip features advanced ringing compensation resulting in fast lens settling time for faster focus – 10-mS settling time compared to 150 mS without ringing compensation.
Marketwire: Cadence announced new MIPI verification suits:
Marketwire: While we are at MIPI, Tektronix announced M-PHY testing solution based on the newly-ratified M-PHY v1.0 specification. Building on the industry's first M-PHY test offering introduced last September, Tektronix now offers mobile device hardware engineers a simple, integrated solution for M-PHY Transmitter and Receiver debug, validation and conformance testing needs. Developed in close cooperation with Synopsys and ST-Ericsson, the Tektronix "2-box" solution provides scope-integrated error detection for receiver tolerance testing and re-usability with a single set-up for both the M-PHY and lower-speed D-PHY(SM) specifications.
Toronto, Canada-based ISee3D announced the next step in its single-lens 3D imaging technology that cuts its 3D lens down to size and increases frame rates, for the first time making practical a range of applications and bringing 3D to more markets, such as consumer, automotive, industrial, and medical devices.
The advanced new technology dramatically reduces the thickness of the elements to fractions of a millimeter, making it possible to use the technology with a wider variety of lenses and reducing the space required. Now ISee3D technology fits for equipping webcams, microscopes, endoscopes, 4 and 5K cameras and consumer camcorders with 3D capabilities. In the field of endoscopy, the ability to capture 3D images through a smaller device enables less invasive surgeries, and a new ISee3D innovation in this field allows a 3D endoscope to produce as much or more light as a 2D device of the same size.
Click on picture to see the animated explanation of how it works:
Marketwire: Cadence announced new MIPI verification suits:
- MIPI CSI-3: Providing an advanced processor-to-camera sensor interface.
- MIPI Low Latency Interface (LLI): This interface cuts mobile device production cost by allowing DRAM memory sharing between multiple chips.
Marketwire: While we are at MIPI, Tektronix announced M-PHY testing solution based on the newly-ratified M-PHY v1.0 specification. Building on the industry's first M-PHY test offering introduced last September, Tektronix now offers mobile device hardware engineers a simple, integrated solution for M-PHY Transmitter and Receiver debug, validation and conformance testing needs. Developed in close cooperation with Synopsys and ST-Ericsson, the Tektronix "2-box" solution provides scope-integrated error detection for receiver tolerance testing and re-usability with a single set-up for both the M-PHY and lower-speed D-PHY(SM) specifications.
Toronto, Canada-based ISee3D announced the next step in its single-lens 3D imaging technology that cuts its 3D lens down to size and increases frame rates, for the first time making practical a range of applications and bringing 3D to more markets, such as consumer, automotive, industrial, and medical devices.
The advanced new technology dramatically reduces the thickness of the elements to fractions of a millimeter, making it possible to use the technology with a wider variety of lenses and reducing the space required. Now ISee3D technology fits for equipping webcams, microscopes, endoscopes, 4 and 5K cameras and consumer camcorders with 3D capabilities. In the field of endoscopy, the ability to capture 3D images through a smaller device enables less invasive surgeries, and a new ISee3D innovation in this field allows a 3D endoscope to produce as much or more light as a 2D device of the same size.
Click on picture to see the animated explanation of how it works:
