Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML’s NXE:3100 EUV lithography tools in the field, improving the tools’ overlay and critical dimension (CD) tool performance.
The sensors were processed according to ASML’s custom designs and specifications, with focus on superior lifetime and sensitivity to direct and high EUV irradiation doses. Two of the sensors are designed to calibrate, align, and focus tool’s lens systems. They have been integrated in functional sensor modules, and are being integrated in the NXE:3100 machines in the field. A third sensor is designed to monitor the NXE:3300’s EUV dose. The next milestone in progress is to build and qualify the different sensors for the NXE:3300 by the end of 2011.
The sensors were processed according to ASML’s custom designs and specifications, with focus on superior lifetime and sensitivity to direct and high EUV irradiation doses. Two of the sensors are designed to calibrate, align, and focus tool’s lens systems. They have been integrated in functional sensor modules, and are being integrated in the NXE:3100 machines in the field. A third sensor is designed to monitor the NXE:3300’s EUV dose. The next milestone in progress is to build and qualify the different sensors for the NXE:3300 by the end of 2011.
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| Wafer with EUV sensor dies, produced on imec's 200mm CMORE line. Click to enlarge. |
