SPIE published a news article on Raytheon doing hybrid FPAs for visible imaging in space: "Advances in large-format visible focal plane technology". The array is based on 8um PIN photodiodes attached to the readout dies using "direct-bond-hybridization process". FPAs are radiation-hard to >200kRad making them suitable for NASA interplanetary missions.
The reported FPA size is 1.04MP, but Raytheon Reticle Image Composition Lithography (RICL) technology is said to allow stitching arrays together to fabrication of FPAs up to 16×16k. The readout noise is 7e-. The ADC resolution is 13b.
The reported FPA size is 1.04MP, but Raytheon Reticle Image Composition Lithography (RICL) technology is said to allow stitching arrays together to fabrication of FPAs up to 16×16k. The readout noise is 7e-. The ADC resolution is 13b.
