Toshiba announced a reorganization of its semiconductor production facilities in Japan that affects its discrete, analog and imaging IC businesses. In the analog and imaging IC businesses, Toshiba will continue to promote a shift to production on larger wafers to improve manufacturing efficiency and cost competitiveness. Toshiba has been implementing a series of measures to restructure its discrete and analog and imaging IC businesses, including accelerating the transfer of assembly and test operations to overseas facilities, outsourcing, shifting to larger diameter wafer production lines and halving its product line-up. Regular employees at the affected facilities will, in principle, be redeployed within Toshiba Group.
In addition Toshiba is temporarily cutting production at some of its semiconductor facilities from late November 2011 to early January 2012, including Oita Operations, which produces analog semiconductors and image sensors. The Oita facility will have 6-day shutdown during Year-end and New-Year's Holidays (Dec.30-Jan.4) plus the production will be decreased.
In addition Toshiba is temporarily cutting production at some of its semiconductor facilities from late November 2011 to early January 2012, including Oita Operations, which produces analog semiconductors and image sensors. The Oita facility will have 6-day shutdown during Year-end and New-Year's Holidays (Dec.30-Jan.4) plus the production will be decreased.
