Teledyne DALSA announces it's in the design phase of a revolutionary, next generation image sensor to address a multitude of markets and benefit machine vision system designers from the factory floor to large scale OEMs. Expectations are that this latest chip will fully eclipse today’s technology for general machine vision — especially for food and environmental inspection. The chip will be available in 3 resolutions, 1, 4 and 12 Megapixels with two primary pixel sizes – 5 and 25 µm. Starting with the base pixel, the sensor field-of-view can be adjusted to meet most requirements, covering a range of 5 –100µm pixel pitch.
As a result of the properties of the silicone, pixel size can be finely tuned by camera or module design, and based on the theoretical properties of the underlying technology we estimate pixel size could vary from 1 to 10x base. In addition, with the current state of the art we are expecting to demonstrate a 1-4x expansion ratio.
As a result of the properties of the silicone, pixel size can be finely tuned by camera or module design, and based on the theoretical properties of the underlying technology we estimate pixel size could vary from 1 to 10x base. In addition, with the current state of the art we are expecting to demonstrate a 1-4x expansion ratio.
