Austrian mixed-signal foundry AMS invests over €25m to create an in-house production capacity for 3D ICs, including stacked sensor, among other 3D integrated chips. "The AMS 3D IC process also enables the production of stacked-die devices. Two die produced in different processes (such as a photodiode die and a silicon signal-processing die) are bonded back-to-back to produce a monolithic stacked-die device."
The new equipment line, which will be fully operational by the end of 2013, will be available for production of 3D ICs for any AMS product or full-service foundry customer. Initially the line will produce devices for customers in the medical imaging and mobile phone markets.
Thanks to PD for the link!
The new equipment line, which will be fully operational by the end of 2013, will be available for production of 3D ICs for any AMS product or full-service foundry customer. Initially the line will produce devices for customers in the medical imaging and mobile phone markets.
Thanks to PD for the link!
