PR Newswire: China-based Wafer Level Chip Scale Package (WLCSP) has been listed on the Shanghai Stock Exchange and has raised US$118M with an IPO price of US$780M - not a bad valuation for a company that begun as an image sensor packaging house. The company started in 2005, when essentially all Shellcase manufacturing business was moved to China. Shellcase R&D team was sold to Tessera for $33M in 2006, while WLCSP manufacturing in China grew into a large business, although still remaining in 8-inch wafer realm:
