EETimes publishes an interview with Pierre Cambou, one of the authors of Yole's recent report on CMOS sensor market. Yole predicts that the next trend will likely be 3-D Hybrid CMOS image sensors that by-pass the TSVs for high precision direct copper-to-copper wafer bonding, allowing per-pixel interconnects between the wafers:
Another interesting point is that Yole seems to be too conservative estimating the image sensor market growth in its reports:
Another interesting point is that Yole seems to be too conservative estimating the image sensor market growth in its reports:
