2015 International Image Sensor Workshop (IISW) to be held on June 8-11, 2015 in Vaals, The Netherlands, publishes its program. There is quite a lot of interesting papers. Just to name a few of the broader public interest:
Sony and Canon present image sensor with phase detection autofocus in ALL pixels:
A Low Noise and High Sensitivity Image Sensor with Imaging and Phase-Difference Detection AF in All Pixels
M.Kobayashi, M.Johnson, Y.Wada, H.Tsuboi, J.Iwata, T.Ono, H.Takada, K.Togo, Y.Arishima, T.Kishi, A.Okita, H.Takahashi, T.Ichikawa
Canon Inc., Japan
A 4M pixel full-PDAF CMOS image sensor with 1.58μm 2X1 On-Chip Micro-Split-Lens technology
Sozo Yokogawa, Isao Hirota, Isao Ohdaira, Masao Matsumura, Atsushi Morimitsu, Hiroaki Takahashi, Toshio Yamazaki, Hideki Oyaizu, Yalcin Incesu, Muhammad Atif, Yoshikazu Nitta
Sony Japan and Germany
Omnivision, Sony and Olympus present the updates on their latest stacked sensor work:
Stack Chip Technology: A New Direction for CMOS Imagers
V.C. Venezia, H. Rhodes, C. Shih, W.Z. Yang, and B. Zhang
OmniVision, USA
A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode using 4 million interconnections
Toru Kondo, Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda and Yoshitaka Tadaki
Olympus Corp., Japan
A 1/1.7-inch 20Mpixel Back-illuminated Stacked CMOS Image Sensor with parallel multiple sampling
Hayato Wakabayashi, Atsushi Suzuki, Nobutaka Shimamura, Toshiki Kainuma, Kensuke Koiso, Atsushi Masagaki, Yoichi Yagasaki, Shigeru Gonoi, Masatoshi Mizuno, Tatsuya Sugioka, Takafumi Morikawa, Yoshiaki Inada
Sony, Japan
Qualcomm and TSMC present new CFA ideas:
New Color Filter Patterns and Demosaic for Sub-micron Pixel Arrays
Biay-Cheng Hseih, Hasib Siddiqui, Todor Gerogiev, Kalin Atanassov, Sergio Goma, and
HY Cheng, JJ Sze, HY Chou, Calvin Chao, SG Wuu
Qualcomm Inc., USA
TSMC, Taiwan
Sony and Canon present image sensor with phase detection autofocus in ALL pixels:
A Low Noise and High Sensitivity Image Sensor with Imaging and Phase-Difference Detection AF in All Pixels
M.Kobayashi, M.Johnson, Y.Wada, H.Tsuboi, J.Iwata, T.Ono, H.Takada, K.Togo, Y.Arishima, T.Kishi, A.Okita, H.Takahashi, T.Ichikawa
Canon Inc., Japan
A 4M pixel full-PDAF CMOS image sensor with 1.58μm 2X1 On-Chip Micro-Split-Lens technology
Sozo Yokogawa, Isao Hirota, Isao Ohdaira, Masao Matsumura, Atsushi Morimitsu, Hiroaki Takahashi, Toshio Yamazaki, Hideki Oyaizu, Yalcin Incesu, Muhammad Atif, Yoshikazu Nitta
Sony Japan and Germany
Omnivision, Sony and Olympus present the updates on their latest stacked sensor work:
Stack Chip Technology: A New Direction for CMOS Imagers
V.C. Venezia, H. Rhodes, C. Shih, W.Z. Yang, and B. Zhang
OmniVision, USA
A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode using 4 million interconnections
Toru Kondo, Yoshiaki Takemoto, Kenji Kobayashi, Mitsuhiro Tsukimura, Naohiro Takazawa, Hideki Kato, Shunsuke Suzuki, Jun Aoki, Haruhisa Saito, Yuichi Gomi, Seisuke Matsuda and Yoshitaka Tadaki
Olympus Corp., Japan
A 1/1.7-inch 20Mpixel Back-illuminated Stacked CMOS Image Sensor with parallel multiple sampling
Hayato Wakabayashi, Atsushi Suzuki, Nobutaka Shimamura, Toshiki Kainuma, Kensuke Koiso, Atsushi Masagaki, Yoichi Yagasaki, Shigeru Gonoi, Masatoshi Mizuno, Tatsuya Sugioka, Takafumi Morikawa, Yoshiaki Inada
Sony, Japan
Qualcomm and TSMC present new CFA ideas:
New Color Filter Patterns and Demosaic for Sub-micron Pixel Arrays
Biay-Cheng Hseih, Hasib Siddiqui, Todor Gerogiev, Kalin Atanassov, Sergio Goma, and
HY Cheng, JJ Sze, HY Chou, Calvin Chao, SG Wuu
Qualcomm Inc., USA
TSMC, Taiwan
