Leveraging on IME's 300mm TSV line which features advanced capabilities in TSV wafer thinning, bonding, redistribution layer (RDL) and bumping, this project will develop a TSV process for integration with the CIS device. The project targets higher performance applications, including next generation high resolution SLR cameras and camcorders, as well as smartphones, digital cameras and tablet computers.
"IME continues to enjoy a successful partnership with UMC and remains committed to innovation and cutting-edge technology development to help UMC quickly capture new growth opportunities," commented Professor Dim-Lee Kwong, Executive Director of IME.
Po Wen Yen, SVP at UMC, added, "We are delighted to expand our relationship with IME for BSI technology using TSV. IME's capabilities and expertise in TSV integration will complement UMC's successful efforts for via-middle and via-last TSV on standard 28nm CMOS, and will be a valuable asset to help us extend our market and technology leadership in CMOS image sensor."
