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Chipworks got a hold of Sony stacked sensor, the
ISX014. The 8MP sensor features 1.12um pixels and integrated a high speed ISP.
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Cross Section Showing the TSVs |
Chipworks says: "
A thin back-illuminated CIS die (top) mounted to the companion image processing engine die and vertically connected using a through silicon via (TSV) array located adjacent to the bond pads. A closer look at the TSV array in cross section shows a series of 6.0 µm pitch vias connecting the CIS die and the image processing engine."
Thanks to RF for updating me!
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