“With S3, we establish a new standard of H.265 encoding excellence to enable future generations of the highest quality HD and Ultra HD IP cameras,” said Fermi Wang, President & CEO of Ambarella.
The S3 family comprises software-compatible SoCs that range in performance from 1080p60 to 4Kp60 video with support for multiple streams and transcoding between H.264 and H.265 formats. S3 includes a 1.2 GHz dual-core ARM Cortex-A9 CPU with floating point and NEONTM as well as dedicated DSP subsystems for ISP, video compression and analytics. It also supports comprehensive I/O including high-speed SLVS/MIPI/HiSPI sensor interfaces, USB host and client and gigabit Ethernet. The S3 Linux-based SDK allows designers to create IP cameras with differentiated features including wireless connectivity, cloud services, wide-angle panorama viewing, analytics, edge recording and transcoding.
S3 Feature Summary:
- H.265 (HEVC) Main Profile encoding up to 4Kp30 video with support for Ambarella SmartHEVC low-bitrate streaming enhancements.
- H.264 (AVC) Baseline/Main/High Profile Level 5.1 encoding up to 4Kp60 video with support for Ambarella SmartAVC low-bitrate streaming enhancements.
- Flexible encoder engine supporting multiple streams with independent resolution, frame rate, quality and codec configurations. Support for transcoding between H.265 and H.264, Scalable Video Codec (SVC-T) and sub-frame low-delay encoding.
- ISP with high-speed SLVDS/MIPI®/HiSPi™ interfaces supporting up to 64MP sensor resolution.
- Line-interleaved multi-exposure HDR processing up to 4Kp30.
- Motion-compensated 3D noise reduction with de-ghosting to enhance low-light performance.
- 1.2 GHz Dual Core ARM Cortex-A9 CPU with floating point, NEON and 1 MByte full speed L2 cache. Intelligent video analytics hardware acceleration.
- Real-time hardware-accelerated de-warping for 180/360 degree panoramic lenses with up to 4Kp30 performance, multiple window layouts and digital PTZ.
- AES/3DES/SHA-1/MD5 encryption engines.
- Support for DDR4/DDR3/DDR3L, gigabit Ethernet, USB 2.0 host and device, HDMI® 2.0, SDXC SD™ Card, and dual sensor interfaces.
- Low-power 28nm process
