Introduction
- Applications for 3D image sensors
- Range sensing technologies: taxonomy, pros and cons
- Active range sensors (Triangulation, Interferometry and Time-of-Flight): operation principle and solid-state implementation
- Time-of-Flight measurement principle and implementations
- Building blocks
- Optical power budget and system design considerations
- Technical requirements for 3D Time-of-Flight image sensors
- History and evolution of 3D image sensors versus 2D
- Evolution of PDM-devices from CCD to CIS
- Description and analysis of State-of-the-art PDM implementations
- Description and analysis of SoA ES solutions
- From photodiode to SPAD through APDs
- SPAD operation principle and behavioural model
- SPAD front-end and processing electronics
- Description and analysis of SoA SPAD-based solutions
- Pros and cons of each detector technology and best application scenarios
- Sensor architectures, column amplifiers, ADCs, on-chip processing blocks
- Extra electronics needed by 3D Time-of-Flight with respect to 2D (TDCs, TACs, drivers)
- Noise analysis and case study for PDM, ES and SPAD sensors
- How to test a 3D Time-of-Flight imager
- Main Figures of Merit
- Best 3D sensor technology for your application
- System aspects and trade-offs
- Future perspective and roadmap
