The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip:
iPhone SE Features Sony and Omnivision Sensors
online engineering degree/engineering degree online/online engineering courses/engineering technology online/engineering courses online/engineering technician degree online/online engineering technology/electronic engineering online
Chipworks reverse engineering reveals that Apple iPhone SE FaceTime front-facing camera uses Omnivision 1.2MP sensor with pixel pitch of 1.75 µm. The die, which features OV2E0BNN die markings, has a size of 4.3 mm x 4.1 mm (17.6 mm2):
The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip:
online civil engineering technology degree/online electrical engineering degree/online electrical engineering degree abet/online electrical engineering technology degree/online engineering courses/online engineering degree/online engineering technology/online engineering technology degree/online engineering technology degree programs/online mechanical engineering technology degree
The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip: