During the past five years, the IEE Dresden team has developed mixed-signal ASIC designs for sensor applications. They also helped to develop the core 3D ToF technology, which resulted in a variety of products based on IEE’s 3D MLI Sensor - the Tailgate Detector TDflex, People Counter and Volumetric Object Surveillor. The mixed-signal chip design, along with the test and qualification experience of the Dresden team, will strengthen PMD’s position as a 3D ToF image sensor company. "The consolidation of the existing 3D ToF know-how at PMD and IEE Vision Sensing will advance PMD’s technology to new levels of innovation and quality,” says Prof. Mierau, PMD’s new Branch Manager Dresden.
In addition to the acquisition, IEE and PMD have also established a strategic cooperation. IEE will continue to expand their 3D image sensing product portfolio, particularly for automotive and building security applications, while PMD will use their six years of experience supplying mass market 3D chips, to support both IEE’s existing and new products.
