The CIS production seems to take a good chunk of the Crolles 300mm fab's capacity:
ST develops 1.1um and 0.9um pixel process, apparently cooperating with 2 foundries. So far, only cooperation with UMC has been announced:
0.9um pixel is scheduled to appear in 2014:
In recent years ST has introduced a lot of CIS process extensions:
The Imaging Division presentation talks about the achievements and strategies:
The progress in camera phones sensors includes:
- Ramp-up of BSI process one quarter ahead of schedule for smartphone maker flagship device
- Including brand new technology concept
- High Performance Pixel: DTI, Vertical Diode, large pixel, HDR, low dark optimization
- Investment of color capacity into Crolles 300mm ready in 3Q13 (+100%)
- 65nm Back Side Illumination process development with UMC under execution as planned