Oppenheimer Talks About OmniBSI-2 Production Problems

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Oppenheimer report quotes unnamed sources saying "In addition to yield issues with BSI-2 at TSMC, our checks hint at some material compatibility issue with encapsulant materials during packaging of image sensor lenses." and then also "In addition to yield problems at TSMC (image sensor fabrication is never easy), we also think, based on our checks, that some encapsulant/adhesive materials compatability/delamination was involved, in keeping with the company's prior suggestion of an unexpected discovery of problems."

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