online engineering degree/engineering degree online/online engineering courses/engineering technology online/engineering courses online/engineering technician degree online/online engineering technology/electronic engineering online
Chipworks publishes die photographs of iPhone 5 image sensors:
|
Sony 8MP BSI primary sensor |
The primary camera module has 8.0 mm x 8.7 mm x 5.2 mm size, while the die size is 6.15 mm x 5.81 mm. The sensor is made by Sony and based on 1.4um BSI pixels.
|
Omnivision 1.2MP front camera, color filter removed |
The front-facing Omnivision's sensor has 1.2MP resolution and is based on 1.75um pixels. Its die size is 3.35 mm x 4.15 mm, the module size is 5.5 mm x 6.0 mm x 3.6 mm.
online civil engineering technology degree/online electrical engineering degree/online electrical engineering degree abet/online electrical engineering technology degree/online engineering courses/online engineering degree/online engineering technology/online engineering technology degree/online engineering technology degree programs/online mechanical engineering technology degree