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Ubergizmo quotes Japanese-language
Egami blog (via
Google translation) describing a recently published Sony patent application on a method to create a curved image sensor surface. I was unable to find the original patent application link, so the only available info is what's published by Egami:
According to the Egami post, Sony proposes to control curvature by varying the magnetic force, volumetric shrinkage of the base due to heat, or by changing a vacuum suction force. Sony says that one needs to leave a flat portion of silicon around the curved one to avoid cracks.
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