online engineering degree/engineering degree online/online engineering courses/engineering technology online/engineering courses online/engineering technician degree online/online engineering technology/electronic engineering online
EV Group (EVG) joins the 3D integration consortium of IRT Nanoelec headed by CEA-Leti and includes STMicro and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.
Séverine Chéramy, director of the 3D integration program of IRT Nanoelec, said the consortium expects to achieve an interconnection pitch of about 1µm.
"
Wafer-to-wafer stacking using direct Cu-to-Cu bonding is key for advanced 3D technologies, specifically for imaging application and 3D partitioning," Chéramy said. "
EVG's knowledge on bonding will leverage the process expertise of the original members. The participation of EVG in the consortium will create new opportunities and optimized and cost-effective solutions for 3D IC devices."
online civil engineering technology degree/online electrical engineering degree/online electrical engineering degree abet/online electrical engineering technology degree/online engineering courses/online engineering degree/online engineering technology/online engineering technology degree/online engineering technology degree programs/online mechanical engineering technology degree