December 2016 ~ engineering information technology

Caltech Flat Lens can be Integrated onto Image Sensor

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Engineers at Caltech have developed a system of flat optical lenses that are said to be easily mass-produced and integrated with image sensors, paving the way for cheaper and lighter cameras. The technology...

AR/VR News Roundup

AR glasses maker Osterhout Design Group (ODG) has raised $58M at valuation of $258M in series A financing round. Shenzhen O-film Tech Co., Vanfund Urban Investment & Development Co. and several individual...

Hitachi Lensless Sensor Principles

StackExchange had an interesting discussion on how Hitachi lensless camera works. Steve Byrnes posts a nice guess that can explain ...

Trinamix Presents Hertzstück PbS Photodetectors

On the way to commercialize BASF 3D imaging solution, its wholly owned subsidiary Trinamix presents "the new first bondable bare chip infrared PbS sensor: Hertzstück.""For Hertzstück PbS detectors we...

Rockchip Prepares Visual Processing Solution

One of the largest Chinese application processor manufacturers Rockchip presents the soon-to-be-announced RV1108 vision and image processing SoC demos: "The comparison of drive test results verifies the...

Sony Announces World's Smallest 1.06MP Camera Module

Sony announces the IU233N2-Z (color) and IU233N5-Z (monochrome) camera modules for wearable and small mobile device market. Sony says the are the world's smallest 1MP camera modules, as of Nov. 2016....

Himax Announces 5.5MP UltraSenseIR BSI Sensor

GlobeNewsWire: Himax Imaging announces the HM5530 UltraSenseIR low power and low noise 5.5 MP BSI CMOS sensor with more than 40% NIR QE for the next generation of computer vision applications such as 3D camera, autonomous navigation, event and pattern recognition and human-machine interaction.“Computer...

Lensless Future?

Nikkei publishes an article "The future of photography looks lensless," mostly about Hitachi lensless camera prototype. Few quotes:"In Japan, the leader is Hitachi, which recently announced the development...

Yole on Thinned Wafers Demand

Yole Developpement report on thinned wafers has interesting comparisons of image sensor vs other wafers thickne...

TSMC ToF Pixel Patent Application

TSMC patent application US20160358955 "Depth sensing pixel, composite pixel image sensor and method of making the composite pixel image sensor" by Calvin Yi-ping Chao, Kuo-yu Chou, and Chih-min Liu proposes...

Almalence Interview

Forbes publishes an interview with Eugene Panich, Almalence CEO and Founder. Few intersting quotes:"Almalence's imaging solutions are licensed by top smartphone manufacturers, shipping more than 30 million high-end devices annually.SuperSensor uses multiple input frames to produce a single image, thus...

Toshiba Presents 0.7 x 0.7mm Endoscopic Camera

Toshiba introduces the IK-CT2, an ultra-small, chip-on-tip video camera system. The 0.7 x 0.7mm BSI CMOS sensor features 220 x 220 pixels, 60fps frame rate, and integrated 120 deg. FOV F4.5 glass le...

Custom Image Sensor Design Houses News

A new custom design company Imagica Technology has just been formed, by Rob Hannebauer in Vancouver, Canada. Their first designs are a couple of custom CMOS sensors for an unidentified company but they...

Hamamatsu Image Sensor Lineup

Hamamatsu publishes an updated Dec. 2016 book of its image sensors featuring nice insets with popular explanations of image sensor technolo...

LeddarTech Explains 2D, 3D and MEMS Scanning Automotive LiDAR Operation

LeddarTech publishes two Youtube videos explaining 2D and 3D flash LiDAR and MEMS scanning LiDAR principles:Update: Since LeddarTech has removed its Flash LiDAR video, here is Quanergy lecture on its own version, delivered by Louay Eldada, the company CEO and Found...

Tessera FotoNation and VeriSilicon Partner on Vision Processor

BusinessWire: FotoNation and Shanghai, China-based VeriSilicon are to jointly develop an image processing platform that is promised to offer best-in-class programmability, power, performance and area for computer vision (CV), computational imaging (CI) and deep learning. The new IP platform, named IPU...

ESPROS Announces New Products

ESPROS December 2016 Newsletter says that its ToF chips are "being used in more and more volume products... In the consecutive months we will extend our ToF product line with a 160x60 and a fast 8x8...

3D Imaging for AR Devices

Vance Vids publishes a series of videos on Magic Leap AR glasses concepts. While the first two videos are quite speculative, the third one has a nice explanation why 3D camera is so important in AR devic...

Smartphone Features 30MP (?) Selfie Camera

Gizmochina reports that Chinese company 8848 Phone has launched a high-end smartphone featuring 21MP main camera at the rear and a 30MP front facing selfie camera. The phone has a number of other high...

GS Sensors at IEDM

IEEE Spectrum publishes a review of two global shutter papers presented at IEDM 2016. Tohoku University, Japan talks about 1M fps image sensor with 480 frames trench-capacitor based analog memory. The...

SNR Explanation

Albert Theuwissen publishes an excellent discussion of SNR definition, including some rarely mentioned stuff:"in the case the sensor is used for video applications, very often the photon shot noise is omitted in the total noise Nout, and actually the SNR listed in the data sheets is much higher than...

Canon Applies for RGBW12 CFA Patent

CanonWatch quotes Japanese-language Egami site that Canon has applied for RGB-W CFA pattern patent. The US version of this patent is available here and appears to describe an image processing pipeline...

IDC on AR/VR Market Prospects

In spite of reports of lower than expected sales of VR headsets, IDC keeps optimistic view on AR/VR market:"Worldwide AR and VR headset shipments are expected to see a compound annual growth rate (CAGR)...

Sony IEDM Paper

Nikkei reviews Sony IEDM 2016 paper on polarization sensitive image sensor.Regular polarization sensor (left) and Sony sensor (right)Polarizer grids (left). Top AR layer prevents image ghos...

e2v Emerald 2.8um Global Shutter Sensors Presentation

This post has been removed by e2v reque...

Anteryon Introduces Modular SpectroBlocks

Anteryon presents an interesting concept of a modular architecture for fit-for-use spectroscopy: SpectroBlocks - miniature spectrum analyzers that can be assembled by simply clicking them together:The...

Synaptics Partners with OXi Technology on Optical Fingerprint Sensors

GlobeNewswire: Synaptics announces an exclusive partnership with OXi Technology, a Shanghai-based developer of optical fingerprint technology. The collaboration includes combining technology from each...

Forza on Stacked Image Sensor Options for the Fabless

BusinessWire: Forza Silicicon president, Barmak Mansoorian, will present a talk titled “3D Integrated Image Sensor: Options for the Fabless” at the 2016 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference in San Francisco on December 14. The presentation discusses the benefits,...

NIT Logarithmic Sensor for Smart Vision Cameras

SpectroNet publishes New Imaging Technologies (NIT) Yang Ni's video presentation on logarithmic sensor for smart vision camer...

Pixpolar Technology in PhD Thesis

Lappeenranta University of Technology (LUT), Finland, publishes PhD Thesis "Novel Solutions for Improving Solid-State Photon Detector Performance and Manufacturing" by Vladislav Marochkin. The thesis...

Teledyne to Acquire e2v for $789M

BusinessWire: Teledyne and e2v jointly announce that they have reached agreement on the terms of a cash acquisition to be made by Teledyne for e2v. The aggregate enterprise value for the transaction is expected to be approximately £627 million (or approximately $789 million) taking into account e2v...

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